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11 - 20 of 4,164 results
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S2569BP
ams
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Check for Price | No | Obsolete | CMOS | TELEPHONE DIALER CIRCUIT | 3.58 MHz | 1 | 1.5 µA | COMMERCIAL | R-PDIP-T18 | e0 | Not Qualified | 60 °C | -20 °C | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | AMS AG | DIP | DIP, DIP18,.3 | 18 | unknown | 8542.39.00.01 | |||||||||||||||
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ICM7115
IC Microsystems Sdn Bhd
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Check for Price | Yes | Contact Manufacturer | 3.5 V | CMOS | TELEPHONE MULTIFUNCTION CIRCUIT | 2:3 MAKE/BREAK RATIO IS ALSO SELECTABLE | 1:2 | 1 | 5.5 µA | OTHER | R-PDSO-G28 | Not Qualified | 70 °C | -25 °C | 28 | PLASTIC/EPOXY | SOP | SOP28,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 7.49 mm | 17.8308 mm | 2.6416 mm | IC MICROSYSTEMS SDN BHD | SOIC | SOP, SOP28,.4 | 28 | unknown | 8542.39.00.01 | ||||||||||||
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AN6154NK
Panasonic Electronic Components
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Check for Price | No | Obsolete | BIPOLAR | TELEPHONE SPEECH CIRCUIT | 1 | 120 µA | COMMERCIAL | R-PDIP-T22 | e0 | Not Qualified | 70 °C | -20 °C | 22 | PLASTIC/EPOXY | SDIP | SDIP24,.3 | RECTANGULAR | IN-LINE, SHRINK PITCH | NO | TIN LEAD | THROUGH-HOLE | 1.778 mm | DUAL | 7.62 mm | 19.1 mm | 4.75 mm | PANASONIC CORP | DIP | SDIP, SDIP24,.3 | 22 | unknown | 8542.39.00.01 | |||||||||||||
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AS2532AP
ams
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Check for Price | Obsolete | 5 V | TELEPHONE MULTIFUNCTION CIRCUIT | 1:2 | 1 | R-PDIP-T28 | Not Qualified | 28 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | AMS AG | DIP | DIP, | 28 | unknown | 8542.39.00.01 | ||||||||||||||||||||||||
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W91330ALN
Winbond Electronics Corp
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Check for Price | No | Obsolete | 2.5 V | CMOS | TELEPHONE DIALER CIRCUIT | 3.58 MHz | 2:3 | 1 | 600 nA | COMMERCIAL | R-PDIP-T20 | e0 | Not Qualified | 70 °C | -20 °C | 20 | PLASTIC/EPOXY | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 20.06 mm | 4.45 mm | WINBOND ELECTRONICS CORP | DIP | DIP, DIP20,.3 | 20 | unknown | 8542.39.00.01 | ||||||||||
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U3761MB-SFN
Temic Semiconductors
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Check for Price | No | Transferred | 2.7 V | TELEPHONE MULTIFUNCTION CIRCUIT | 2:3 | 1 | 100 µA | COMMERCIAL EXTENDED | R-PDSO-G44 | e0 | Not Qualified | 75 °C | -25 °C | 44 | PLASTIC/EPOXY | SSOP | SOP44,.4,32 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 800 µm | DUAL | TEMIC SEMICONDUCTORS | SSO-44 | unknown | ||||||||||||||||||
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STC2586C0C
Epson Electronics America Inc
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Check for Price | No | Contact Manufacturer | BICMOS | 3.58 MHz | REPERTORY | 8 µA | COMMERCIAL | R-PDIP-T22 | e0 | Not Qualified | 70 °C | -20 °C | 22 | PLASTIC/EPOXY | DIP | DIP22,.4 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | SEIKO EPSON CORP | DIP, DIP22,.4 | compliant | 8542.39.00.01 | ||||||||||||||||||
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U4091BM-RFNY
Atmel Corporation
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Check for Price | Yes | Obsolete | 3.3 V | TELEPHONE MULTIFUNCTION CIRCUIT | 1 | COMMERCIAL EXTENDED | R-PDSO-G44 | e3 | 1 | 75 °C | -25 °C | 260 | 44 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 800 µm | DUAL | 7.4 mm | 17.925 mm | 2.35 mm | ATMEL CORP | SSOP | SSOP, | 44 | compliant | 8542.39.00.01 | 5A991.G | |||||||||||||
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BA6566FP-DXT2
ROHM Semiconductor
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Check for Price | Yes | Yes | Active | TELEPHONE SPEECH CIRCUIT | 1 | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | HSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 13.6 mm | 2.11 mm | ROHM CO LTD | SOIC | POWER, HSOP-24 | 24 | compliant | 8542.39.00.01 | ||||||||||||||||
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PCD3332-2P
Philips Semiconductors
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Check for Price | No | Transferred | CMOS | 3.58 MHz | REPERTORY | OTHER | R-PDIP-T28 | e0 | Not Qualified | 70 °C | -25 °C | 28 | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | PHILIPS SEMICONDUCTORS | DIP, DIP28,.6 | unknown | 8542.39.00.01 |