Parametric results for: -23A10 under SRAMs
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23LC1024-I/ST
Microchip Technology Inc
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$2.1446 | Yes | Active | CMOS | 1 | YES | e3 | 85 °C | -40 °C | 8 | RECTANGULAR | MATTE TIN | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.41 | Microchip | 20 MHz | COMMON/SEPARATE | R-PDSO-G8 | 4.4 mm | 1.0486 Mbit | STANDARD SRAM | 8 | 1 | 1 | 131.072 k | 128000 | SYNCHRONOUS | 128KX8 | 3-STATE | NO | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SERIAL | 260 | Not Qualified | TS 16949 | 1.2 mm | 10 µA | 2.5 V | 10 µA | 5.5 V | 2.5 V | 5 V | INDUSTRIAL | GULL WING | 650 µm | DUAL | 3 mm | |||||||
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23A1024-I/ST
Microchip Technology Inc
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$2.2814 | Yes | Active | CMOS | 1 | YES | e3 | 85 °C | -40 °C | 8 | RECTANGULAR | MATTE TIN | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.51 | Microchip | 20 MHz | COMMON/SEPARATE | R-PDSO-G8 | 4.4 mm | 1.0486 Mbit | STANDARD SRAM | 8 | 1 | 1 | 131.072 k | 128000 | SYNCHRONOUS | 128KX8 | 3-STATE | NO | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SERIAL | 260 | Not Qualified | TS 16949 | 1.2 mm | 4 µA | 1.7 V | 10 µA | 2.2 V | 1.7 V | INDUSTRIAL | GULL WING | 650 µm | DUAL | 3 mm | TSSOP-8 | 40 | ||||||
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23LC1024T-I/SN
Microchip Technology Inc
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$2.7055 | Yes | Active | CMOS | 1 | YES | e3 | 85 °C | -40 °C | 8 | RECTANGULAR | MATTE TIN | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.51 | Microchip | 20 MHz | COMMON/SEPARATE | R-PDSO-G8 | 4.9 mm | 1.0486 Mbit | STANDARD SRAM | 8 | 1 | 1 | 131.072 k | 128000 | SYNCHRONOUS | 128KX8 | 3-STATE | NO | PLASTIC/EPOXY | SOP | SOP8,.23 | SMALL OUTLINE | SERIAL | 260 | Not Qualified | TS 16949 | 1.75 mm | 10 µA | 2.5 V | 10 µA | 5.5 V | 2.5 V | 5 V | INDUSTRIAL | GULL WING | 1.27 mm | DUAL | 3.9 mm | SOIC-8 | 40 | |||||
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23LC1024-I/SN
Microchip Technology Inc
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$2.7866 | Yes | Yes | Active | CMOS | 1 | YES | e3 | 85 °C | -40 °C | 8 | RECTANGULAR | MATTE TIN | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.51 | Microchip | 20 MHz | COMMON/SEPARATE | R-PDSO-G8 | 4.9 mm | 1.0486 Mbit | STANDARD SRAM | 8 | 1 | 1 | 131.072 k | 128000 | SYNCHRONOUS | 128KX8 | 3-STATE | NO | PLASTIC/EPOXY | SOP | SOP8,.23 | SMALL OUTLINE | SERIAL | 260 | Not Qualified | TS 16949 | 1.75 mm | 10 µA | 2.5 V | 10 µA | 5.5 V | 2.5 V | 5 V | INDUSTRIAL | GULL WING | 1.27 mm | DUAL | 3.9 mm | 40 | SOIC | 8 | |||
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23A1024-I/SN
Microchip Technology Inc
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$2.7867 | Yes | Active | CMOS | 1 | YES | e3 | 85 °C | -40 °C | 8 | RECTANGULAR | MATTE TIN | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.41 | Microchip | 20 MHz | COMMON/SEPARATE | R-PDSO-G8 | 4.9 mm | 1.0486 Mbit | STANDARD SRAM | 8 | 1 | 1 | 131.072 k | 128000 | SYNCHRONOUS | 128KX8 | 3-STATE | NO | PLASTIC/EPOXY | SOP | SOP8,.23 | SMALL OUTLINE | SERIAL | 260 | Not Qualified | TS 16949 | 1.75 mm | 4 µA | 1.7 V | 10 µA | 2.2 V | 1.7 V | INDUSTRIAL | GULL WING | 1.27 mm | DUAL | 3.9 mm | SOIC-8 | 40 | ||||||
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23LC1024T-I/ST
Microchip Technology Inc
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$2.9278 | Yes | Active | CMOS | 1 | YES | e3 | 85 °C | -40 °C | 8 | RECTANGULAR | MATTE TIN | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.51 | Microchip | 20 MHz | COMMON/SEPARATE | R-PDSO-G8 | 4.4 mm | 1.0486 Mbit | STANDARD SRAM | 8 | 1 | 1 | 131.072 k | 128000 | SYNCHRONOUS | 128KX8 | 3-STATE | NO | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SERIAL | 260 | Not Qualified | TS 16949 | 1.2 mm | 10 µA | 2.5 V | 10 µA | 5.5 V | 2.5 V | 5 V | INDUSTRIAL | GULL WING | 650 µm | DUAL | 3 mm | 40 | ||||||
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23A1024T-I/SN
Microchip Technology Inc
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$2.9450 | Yes | Active | CMOS | 1 | YES | e3 | 85 °C | -40 °C | 8 | RECTANGULAR | MATTE TIN | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.51 | Microchip | 20 MHz | COMMON/SEPARATE | R-PDSO-G8 | 4.9 mm | 1.0486 Mbit | STANDARD SRAM | 8 | 1 | 1 | 131.072 k | 128000 | SYNCHRONOUS | 128KX8 | 3-STATE | NO | PLASTIC/EPOXY | SOP | SOP8,.23 | SMALL OUTLINE | SERIAL | 260 | Not Qualified | TS 16949 | 1.75 mm | 4 µA | 1.7 V | 10 µA | 2.2 V | 1.7 V | INDUSTRIAL | GULL WING | 1.27 mm | DUAL | 3.9 mm | SOIC-8 | 40 | ||||||
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23A1024-I/P
Microchip Technology Inc
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$3.0000 | Yes | Active | CMOS | 1 | NO | e3 | 85 °C | -40 °C | 8 | RECTANGULAR | MATTE TIN | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.51 | Microchip | 20 MHz | COMMON/SEPARATE | R-PDIP-T8 | 9.271 mm | 1.0486 Mbit | STANDARD SRAM | 8 | 1 | 131.072 k | 128000 | SYNCHRONOUS | 128KX8 | 3-STATE | NO | PLASTIC/EPOXY | DIP | DIP8,.3 | IN-LINE | SERIAL | Not Qualified | TS 16949 | 5.334 mm | 4 µA | 1.7 V | 10 µA | 2.2 V | 1.7 V | INDUSTRIAL | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | PDIP-8 | |||||||||
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23LC1024-I/P
Microchip Technology Inc
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$3.0148 | Yes | Active | CMOS | 1 | NO | e3 | 85 °C | -40 °C | 8 | RECTANGULAR | MATTE TIN | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.51 | Microchip | 20 MHz | COMMON/SEPARATE | R-PDIP-T8 | 9.271 mm | 1.0486 Mbit | STANDARD SRAM | 8 | 1 | 131.072 k | 128000 | SYNCHRONOUS | 128KX8 | 3-STATE | NO | PLASTIC/EPOXY | DIP | DIP8,.3 | IN-LINE | SERIAL | 260 | Not Qualified | TS 16949 | 5.334 mm | 10 µA | 2.5 V | 10 µA | 5.5 V | 2.5 V | 5 V | INDUSTRIAL | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | ||||||||
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23A1024T-I/ST
Microchip Technology Inc
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$3.0150 | Yes | Active | CMOS | 1 | YES | e3 | 85 °C | -40 °C | 8 | RECTANGULAR | MATTE TIN | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.51 | Microchip | 20 MHz | COMMON/SEPARATE | R-PDSO-G8 | 4.4 mm | 1.0486 Mbit | STANDARD SRAM | 8 | 1 | 1 | 131.072 k | 128000 | SYNCHRONOUS | 128KX8 | 3-STATE | NO | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SERIAL | 260 | Not Qualified | TS 16949 | 1.2 mm | 4 µA | 1.7 V | 10 µA | 2.2 V | 1.7 V | INDUSTRIAL | GULL WING | 650 µm | DUAL | 3 mm | TSSOP-8 | 40 |