Parametric results for: 1N3029BUR-1 under Zener Diodes
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1N3029BUR-1
Microsemi Corporation
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$9.5676 | No | No | Transferred | 10.5 mA | 1 W | 24 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 25 Ω | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AB | 1 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | DO-213AB | HERMETIC SEALED, GLASS, LL41, MELF-2 | 2 | unknown | EAR99 | 8541.10.00.50 | |||
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JAN1N3029BUR-1
Microchip Technology Inc
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$13.1164 | No | Active | 10.5 mA | 1 W | 24 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/115K | DO-213AB | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | DO-213AB, 2 PIN | compliant | |||||||||
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JANTX1N3029BUR-1
Microchip Technology Inc
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$15.0346 | No | Active | 10.5 mA | 1 W | 24 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/115K | DO-213AB | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | DO-213AB, 2 PIN | compliant | |||||||||
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1N3029BUR-1
Microchip Technology Inc
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$15.7689 | No | Active | 10.5 mA | 1 W | 24 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 25 Ω | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AB | 1 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, LL41, MELF-2 | compliant | ||||||||
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JAN1N3029BUR-1
Microsemi Corporation
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$15.9528 | No | No | Transferred | 10.5 mA | 1 W | 24 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500/115K | DO-213AB | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | DO-213AB | DO-213AB, 2 PIN | 2 | unknown | EAR99 | 8541.10.00.50 | ||||
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JANTX1N3029BUR-1
Microsemi Corporation
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$18.2793 | No | No | Transferred | 10.5 mA | 1 W | 24 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500/115K | DO-213AB | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | DO-213AB | DO-213AB, 2 PIN | 2 | unknown | EAR99 | 8541.10.00.50 | ||||
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JANTXV1N3029BUR-1
Microchip Technology Inc
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$18.5698 | No | Active | 10.5 mA | 1 W | 24 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/115K | DO-213AB | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | DO-213AB, 2 PIN | compliant | |||||||||
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JANTXV1N3029BUR-1/TR
Microchip Technology Inc
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$18.7254 | Active | 10.5 mA | 1 W | 24 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/115K | DO-213AB | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | |||||||||
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JANTXV1N3029BUR-1
Microsemi Corporation
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$20.7138 | No | No | Transferred | 10.5 mA | 1 W | 24 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500/115K | DO-213AB | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | DO-213AB | DO-213AB, 2 PIN | 2 | unknown | EAR99 | 8541.10.00.50 | ||||
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JANTXV1N3029BUR-1
Cobham PLC
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Check for Price | Transferred | 10.5 mA | 1 W | 24 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LELF-R2 | DO-213AB | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | COBHAM PLC | unknown | EAR99 | 8541.10.00.50 |