Parametric results for: 1N3040B under Zener Diodes
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1N3040B-1
Microsemi Corporation
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$7.2261 | No | Transferred | 3.7 mA | 1 W | 68 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 150 Ω | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-41 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-1 | unknown | Microsemi Corporation | ||||||||||
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1N3040B-1
Microchip Technology Inc
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$8.4387 | No | Active | 3.7 mA | 1 W | 68 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 150 Ω | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-41 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-1 | compliant | |||||||||||
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JAN1N3040B-1
Microsemi Corporation
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$9.2334 | No | Transferred | 3.7 mA | 1 W | 68 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-XALF-W2 | e0 | MIL-19500/115K | DO-41 | 175 °C | -55 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-41, 2 PIN | not_compliant | Microsemi Corporation | |||||||||
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JAN1N3040B-1
Microchip Technology Inc
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$9.5528 | No | Active | 3.7 mA | 1 W | 68 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-XALF-W2 | e0 | MIL-19500/115K | DO-41 | 175 °C | -55 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-41, 2 PIN | compliant | ||||||||||
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1N3040BUR-1
Microsemi Corporation
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$9.5676 | No | No | Transferred | 3.7 mA | 1 W | 68 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 150 Ω | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AB | 1 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, LL41, MELF-2 | unknown | Microsemi Corporation | DO-213AB | 2 | EAR99 | 8541.10.00.50 | ||||
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JANTX1N3040B-1
Microchip Technology Inc
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$10.3704 | No | Active | 3.7 mA | 1 W | 68 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-XALF-W2 | e0 | MIL-19500/115K | DO-41 | 175 °C | -55 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-41, 2 PIN | compliant | ||||||||||
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JANTXV1N3040B-1
Microchip Technology Inc
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$12.2558 | No | Active | 3.7 mA | 1 W | 68 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-XALF-W2 | e0 | MIL-19500/115K | DO-41 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-41, 2 PIN | compliant | ||||||||||||
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JAN1N3040BUR-1
Microchip Technology Inc
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$13.1164 | No | Active | 3.7 mA | 1 W | 68 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/115K | DO-213AB | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | DO-213AB, 2 PIN | compliant | |||||||||||
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JANTXV1N3040B-1
Microsemi Corporation
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$14.1738 | No | No | Transferred | 3.7 mA | 1 W | 68 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-XALF-W2 | e0 | MIL-19500/115K | DO-41 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-41, 2 PIN | unknown | EAR99 | 8541.10.00.50 | |||||||||
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JANTX1N3040BUR-1
Microchip Technology Inc
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$15.0346 | No | Active | 3.7 mA | 1 W | 68 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/115K | DO-213AB | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | DO-213AB, 2 PIN | compliant |