Parametric results for: 1N4101 under Zener Diodes
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1N4101
Microchip Technology Inc
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$2.5517 | No | Active | 250 µA | 480 mW | 8.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 5 % | O-LALF-W2 | e0 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | |||||||||||||
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1N4101-1
Microchip Technology Inc
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$2.7217 | No | Active | 250 µA | 480 mW | 8.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/435F | DO-204AH | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | |||||||||||
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1N4101UR
Microchip Technology Inc
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$3.9108 | No | Active | 250 µA | 500 mW | 8.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 200 Ω | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 1 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, MLL34, MELF-2 | compliant | ||||||||||
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1N4101UR-1
Microchip Technology Inc
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$3.9458 | No | Active | 250 µA | 500 mW | 8.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 200 Ω | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 1 | 200 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, SOD-80, LL34, MELF-2 | compliant | ||||||||||
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JAN1N4101-1
Microchip Technology Inc
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$4.2379 | No | Active | 250 µA | 500 mW | 8.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-XALF-W2 | e0 | MIL-19500/435F | DO-35 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-7, 2 PIN | compliant | ||||||||||||
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JANTX1N4101-1
Cobham Semiconductor Solutions
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$5.6563 | Transferred | 250 µA | 500 mW | 8.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | LOW NOISE | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/435 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | AEROFLEX/METELICS INC | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | DO-35 | 2 | EAR99 | 8541.10.00.50 | |||||||||
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1N4101D-1
Microchip Technology Inc
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$6.3419 | No | Active | 250 µA | 480 mW | 8.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 200 Ω | 1 % | O-LALF-W2 | e0 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | |||||||||||
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1N4101D
Microchip Technology Inc
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$6.3419 | No | Active | 250 µA | 480 mW | 8.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 1 % | O-LALF-W2 | e0 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | |||||||||||||
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JAN1N4101UR-1
Microchip Technology Inc
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$8.9757 | No | Active | 250 µA | 1 µA | 500 mW | 8.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 3.936 mV/°C | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/435F | DO-213AA | 1 | 200 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | DO-213AA, 2 PIN | compliant | |||||||
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JANTX1N4101UR-1
Microchip Technology Inc
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$9.2849 | No | Active | 250 µA | 1 µA | 500 mW | 8.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 3.936 mV/°C | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/435F | DO-213AA | 1 | 200 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | DO-213AA, 2 PIN | compliant |