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JANTX1N4573AUR-1
MACOM
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$16.7951 | Transferred | 500 mW | 6.4 V | SILICON | ZENER DIODE | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 0.064 mV/°C | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/452 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | M/A-COM TECHNOLOGY SOLUTIONS INC | MELF-2 | compliant | EAR99 | 8541.10.00.50 | MACOM | ||||||||||
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1N4573AUR-1
Microsemi Corporation
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$17.5109 | No | No | Transferred | 1 mA | 500 mW | 6.4 V | SILICON | ZENER DIODE | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 100 Ω | 0.064 mV/°C | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 1 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, LL34, MELF-2 | unknown | EAR99 | 8541.10.00.50 | DO-213AA | 2 | ||||
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JAN1N4573AUR-1
Microchip Technology Inc
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$19.1754 | No | Active | 500 mW | SILICON | ZENER DIODE | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | Qualified | O-LELF-R2 | e0 | MIL-19500/452 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, LL34, MELF-2 | compliant | |||||||||||||||
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1N4573AUR-1
Microchip Technology Inc
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$19.2604 | No | Active | 1 mA | 500 mW | 6.4 V | SILICON | ZENER DIODE | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 100 Ω | 0.064 mV/°C | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 1 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, LL34, MELF-2 | compliant | Microchip | ||||||||
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JAN1N4573AUR-1/TR
Microchip Technology Inc
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$19.3368 | Active | 500 mW | SILICON | ZENER DIODE | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | Qualified | O-LELF-R2 | e0 | MIL-19500/452 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | |||||||||||||||
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JANTX1N4573AUR-1
Microchip Technology Inc
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$24.6767 | No | Active | 500 mW | SILICON | ZENER DIODE | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | Qualified | O-LELF-R2 | e0 | MIL-19500/452 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, LL34, MELF-2 | compliant | |||||||||||||||
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JAN1N4573AUR-1
Microsemi Corporation
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$25.8014 | No | Transferred | 500 mW | SILICON | ZENER DIODE | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | Not Qualified | O-LELF-R2 | e0 | MIL-19500/452 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, LL34, MELF-2 | unknown | EAR99 | 8541.10.00.50 | DO-213AA | 2 | |||||||||||
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JANTXV1N4573AUR-1
Microchip Technology Inc
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$31.1049 | No | Active | 500 mW | SILICON | ZENER DIODE | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | Qualified | O-LELF-R2 | e0 | MIL-19500/452 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, LL34, MELF-2 | compliant | Microchip | ||||||||||||||
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JANTXV1N4573AUR-1/TR
Microchip Technology Inc
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$31.2620 | Active | 500 mW | SILICON | ZENER DIODE | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | Qualified | O-LELF-R2 | e0 | MIL-19500/452 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | |||||||||||||||
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JANTXV1N4573AUR-1
Microsemi Corporation
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$33.0694 | No | Transferred | 500 mW | SILICON | ZENER DIODE | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | Not Qualified | O-LELF-R2 | e0 | MIL-19500/452 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, LL34, MELF-2 | unknown | EAR99 | 8541.10.00.50 | Microsemi Corporation | DO-213AA | 2 |