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1N4616-1
Microsemi Corporation
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$2.7195 | No | Transferred | 250 µA | 480 mW | 2.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1.3 kΩ | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/435F | DO-204AH | 1 | 200 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS, DO-35, 2 PIN | unknown | Microsemi Corporation | ||||||||
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1N4616-1
Microchip Technology Inc
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$2.8497 | No | Active | 250 µA | 480 mW | 2.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1.3 kΩ | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/435F | DO-204AH | 1 | 200 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | |||||||||
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1N4616-1/TR
Microchip Technology Inc
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$2.8917 | No | Active | 250 µA | 480 mW | 2.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | O-LALF-W2 | e0 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | ||||||||||||
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JAN1N4616-1
Microchip Technology Inc
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$3.8665 | No | Active | 250 µA | 480 mW | 2.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | ||||||||||
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JANTX1N4616-1
MACOM
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$5.0118 | Transferred | 250 µA | 500 mW | 2.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/435 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | M/A-COM TECHNOLOGY SOLUTIONS INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | EAR99 | 8541.10.00.50 | |||||||||||
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JANTX1N4616-1
Microchip Technology Inc
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$5.5034 | No | Active | 250 µA | 500 mW | 2.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/435 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||||
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JANTX1N4616-1
Microsemi Corporation
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$5.6737 | No | No | Transferred | 250 µA | 500 mW | 2.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/435 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | Microsemi Corporation | EAR99 | 8541.10.00.50 | DO-7 | 2 | ||||||
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JANTXV1N4616-1
Microchip Technology Inc
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$5.9519 | No | Active | 250 µA | 500 mW | 2.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/435 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||||
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JANTX1N4616-1
Cobham Semiconductor Solutions
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$9.0394 | Transferred | 250 µA | 500 mW | 2.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/435 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | AEROFLEX/METELICS INC | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | EAR99 | 8541.10.00.50 | DO-35 | 2 | |||||||||
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JANS1N4616-1
Microchip Technology Inc
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$61.1114 | No | Active | 250 µA | 500 mW | 2.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/435 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant |