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Parametric results for: 1N4681CUR-1 under Zener Diodes

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Manufacturer Part Number: 1n4681cur1
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1N4681CUR-1TR
 Microsemi Corporation 		Check for Price No Transferred 50 µA 500 mW 2.4 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER TR, 7 INCH: 2000 2 % Not Qualified O-LELF-R2 e0 DO-213AA 175 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM Tin/Lead (Sn/Pb) WRAP AROUND END MICROSEMI CORP DO-213AA O-LELF-R2 2 compliant EAR99 8541.10.00.50
MX1N4681CUR-1
 Microsemi Corporation 		Check for Price Transferred 50 µA 2 µA 500 mW 2.4 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER HIGH RELIABILITY 1 V 2 % Not Qualified O-LELF-R2 e0 MIL-19500 DO-213AA 175 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WRAP AROUND END MICROSEMI CORP DO-213AA O-LELF-R2 2 compliant EAR99 8541.10.00.50
MQ1N4681CUR-1
 Microsemi Corporation 		Check for Price Transferred 50 µA 2 µA 500 mW 2.4 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER HIGH RELIABILITY 1 V 2 % Not Qualified O-LELF-R2 e0 MIL-19500 DO-213AA 175 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WRAP AROUND END MICROSEMI CORP DO-213AA O-LELF-R2 2 compliant EAR99 8541.10.00.50
MXL1N4681CUR-1
 Microsemi Corporation 		Check for Price Transferred 50 µA 2 µA 500 mW 2.4 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER HIGH RELIABILITY 1 V 2 % O-LELF-R2 e0 MIL-19500 DO-213AA 175 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WRAP AROUND END MICROSEMI CORP compliant EAR99 8541.10.00.50
MV1N4681CUR-1
 Microsemi Corporation 		Check for Price Transferred 50 µA 500 mW 2.4 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER 2 % Not Qualified O-LELF-R2 e0 MIL-19500 DO-213AA 175 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WRAP AROUND END MICROSEMI CORP DO-213AA O-LELF-R2 2 compliant EAR99 8541.10.00.50
MV1N4681CUR-1TR
 Microsemi Corporation 		Check for Price Transferred 50 µA 500 mW 2.4 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER TR, 7 INCH: 2000 2 % Not Qualified O-LELF-R2 e0 MIL-19500 DO-213AA 175 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WRAP AROUND END MICROSEMI CORP DO-213AA O-LELF-R2 2 compliant EAR99 8541.10.00.50
1N4681CUR-1E3
 Microsemi Corporation 		Check for Price Yes Transferred 50 µA 500 mW 2.4 V SILICON ZENER DIODE SINGLE YES 1 ZENER 2 % e3 175 °C Matte Tin (Sn) MICROSEMI CORP compliant EAR99 8541.10.00.50
1N4681CUR-1/TR
 Microsemi Corporation 		Check for Price No Transferred 50 µA 500 mW 2.4 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER TR, 7 INCH: 2000 2 % Not Qualified O-LELF-R2 e0 DO-213AA 175 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM Tin/Lead (Sn/Pb) WRAP AROUND END MICROSEMI CORP HERMETIC SEALED, GLASS, MELF-2 unknown
MA1N4681CUR-1
 Microsemi Corporation 		Check for Price Transferred 50 µA 2 µA 500 mW 2.4 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER HIGH RELIABILITY 1 V 2 % O-LELF-R2 e0 MIL-19500 DO-213AA 175 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WRAP AROUND END MICROSEMI CORP compliant EAR99 8541.10.00.50
MSP1N4681CUR-1
 Microsemi Corporation 		Check for Price Transferred 50 µA 500 mW 2.4 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER 2 % Not Qualified O-LELF-R2 e0 MIL-19500 DO-213AA 175 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WRAP AROUND END MICROSEMI CORP DO-213AA O-LELF-R2 2 compliant EAR99 8541.10.00.50
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