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Parametric » Diodes » Rectifier Diodes

Parametric results for: 1N483BUR under Rectifier Diodes

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Select Parts		Part Number

		1N483BUR Microsemi Corporation
		1N483BUR Microchip Technology Inc

			Most Relevant									Technical			Compliance			Operating Conditions	Physical								Other
Composite Price	Rohs Code	Part Life Cycle Code	Output Current-Max	Forward Voltage-Max (VF)	Power Dissipation-Max	Diode Element Material	Diode Type	Configuration	Surface Mount	Rep Pk Reverse Voltage-Max	Number of Elements	Additional Feature	Non-rep Pk Forward Current-Max	Number of Phases	Qualification Status	JESD-30 Code	JESD-609 Code	Operating Temperature-Max	Case Connection	Number of Terminals	Package Body Material	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Position	Ihs Manufacturer	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

No

Transferred

200 mA

1 V

500 mW

SILICON

RECTIFIER DIODE

SINGLE

YES

225 V

1

METALLURGICALLY BONDED

2 A

1

Not Qualified

O-LELF-R2

e0

175 °C

ISOLATED

2

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROSEMI CORP

HERMETIC SEALED, GLASS PACKAGE-2

2

unknown

EAR99

8541.10.00.70

Microsemi Corporation

No

Active

200 mA

1 V

500 mW

SILICON

RECTIFIER DIODE

SINGLE

YES

225 V

1

METALLURGICALLY BONDED

2 A

1

Not Qualified

O-LELF-R2

e0

175 °C

ISOLATED

2

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED, GLASS PACKAGE-2

compliant

Compare

Microsemi Corporation

No

Transferred

200 mA

1 V

500 mW

SILICON

RECTIFIER DIODE

SINGLE

YES

225 V

1

METALLURGICALLY BONDED

2 A

1

Not Qualified

O-LELF-R2

e0

175 °C

ISOLATED

2

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROSEMI CORP

HERMETIC SEALED, GLASS PACKAGE-2

2

unknown

EAR99

8541.10.00.70

Microsemi Corporation

Microchip Technology Inc

No

Active

200 mA

1 V

500 mW

SILICON

RECTIFIER DIODE

SINGLE

YES

225 V

1

METALLURGICALLY BONDED

2 A

1

Not Qualified

O-LELF-R2

e0

175 °C

ISOLATED

2

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED, GLASS PACKAGE-2

compliant