Parametric results for: 1N5522C under Zener Diodes

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Manufacturer Part Number: 1n5522c
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JAN1N5522C-1
Microchip Technology Inc
$14.5619 No Active 10 mA 500 mW 4.7 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE NO 1 ZENER METALLURGICALLY BONDED 2 % Qualified O-LALF-W2 e0 MIL-19500 DO-204AH 1 175 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WIRE AXIAL MICROCHIP TECHNOLOGY INC HERMETIC SEALED, GLASS, DO-35, 2 PIN compliant
JANTX1N5522C-1
Microchip Technology Inc
$18.8891 No Active 10 mA 500 mW 4.7 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE NO 1 ZENER METALLURGICALLY BONDED 2 % Qualified O-LALF-W2 e0 MIL-19500 DO-204AH 175 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WIRE AXIAL MICROCHIP TECHNOLOGY INC HERMETIC SEALED, GLASS, DO-35, 2 PIN compliant
JANTXV1N5522C-1
Microchip Technology Inc
$24.0768 No Active 10 mA 500 mW 4.7 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE NO 1 ZENER METALLURGICALLY BONDED 2 % Qualified O-LALF-W2 e0 MIL-19500 DO-204AH 175 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WIRE AXIAL MICROCHIP TECHNOLOGY INC HERMETIC SEALED, GLASS, DO-35, 2 PIN compliant
JAN1N5522CUR-1
Microchip Technology Inc
$38.1345 No Active 10 mA 500 mW 4.7 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 AVALANCHE METALLURGICALLY BONDED 22 Ω 2 % Qualified R-LELF-R2 e0 MIL-19500 DO-213AA 200 °C -65 °C ISOLATED 2 GLASS RECTANGULAR LONG FORM TIN LEAD WRAP AROUND END MICROCHIP TECHNOLOGY INC HERMETIC SEALED, GLASS, MLL34, MELF-2 compliant
JANTX1N5522CUR-1
Microchip Technology Inc
$38.9293 No Active 10 mA 500 mW 4.7 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 AVALANCHE METALLURGICALLY BONDED 22 Ω 2 % Qualified R-LELF-R2 e0 MIL-19500 DO-213AA 200 °C -65 °C ISOLATED 2 GLASS RECTANGULAR LONG FORM TIN LEAD WRAP AROUND END MICROCHIP TECHNOLOGY INC HERMETIC SEALED, GLASS, MLL34, MELF-2 compliant
JANTXV1N5522CUR-1
Microchip Technology Inc
$51.0059 No Active 10 mA 500 mW 4.7 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 AVALANCHE METALLURGICALLY BONDED 22 Ω 2 % Qualified R-LELF-R2 e0 MIL-19500 DO-213AA 200 °C -65 °C ISOLATED 2 GLASS RECTANGULAR LONG FORM TIN LEAD WRAP AROUND END MICROCHIP TECHNOLOGY INC HERMETIC SEALED, GLASS, MLL34, MELF-2 compliant
1N5522CUR-1E3
Microsemi Corporation
Check for Price Yes Transferred 10 mA 500 mW 4.7 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER METALLURGICALLY BONDED 2 % O-LELF-R2 e3 DO-213AA 175 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM MATTE TIN WRAP AROUND END MICROSEMI CORP O-LELF-R2 compliant EAR99 8541.10.00.50
JANTX1N5522CUR
Microsemi Corporation
Check for Price No No Obsolete 10 mA 500 mW 4.7 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 AVALANCHE METALLURGICALLY BONDED 2 % Not Qualified R-LELF-R2 e0 DO-213AA 175 °C -65 °C ISOLATED 2 GLASS RECTANGULAR LONG FORM TIN LEAD WRAP AROUND END MICROSEMI CORP R-LELF-R2 compliant EAR99 8541.10.00.50 DO-213AA 2
1N5522C-1E3
Microsemi Corporation
Check for Price Yes Transferred 10 mA 500 mW 4.7 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE NO 1 ZENER METALLURGICALLY BONDED 22 Ω 2 % O-XALF-W2 e3 MIL-19500/437E DO-35 175 °C -65 °C ISOLATED 2 UNSPECIFIED ROUND LONG FORM MATTE TIN WIRE AXIAL MICROSEMI CORP O-XALF-W2 compliant EAR99 8541.10.00.50
JANTX1N5522CUR-1
Cobham PLC
Check for Price Transferred 10 mA 500 mW 4.7 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER METALLURGICALLY BONDED 2 % Not Qualified O-LELF-R2 MIL-19500/437E DO-213AA ISOLATED 2 GLASS ROUND LONG FORM WRAP AROUND END COBHAM PLC DO-213AA, 2 PIN unknown EAR99 8541.10.00.50