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1N5544B
Microsemi Corporation
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$3.1663 | No | No | Transferred | 1 mA | 500 mW | 28 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 100 Ω | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/437E | DO-35 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-35 | HERMETICALLY SEALED, GLASS PACKAGE-2 | 2 | unknown | EAR99 | 8541.10.00.50 | ||||
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1N5544
Microchip Technology Inc
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$3.1702 | No | Active | 1 mA | 500 mW | 28 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 20 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETICALLY SEALED, GLASS PACKAGE-2 | compliant | ||||||||||||
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1N5544A
Microchip Technology Inc
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$3.1702 | No | Active | 1 mA | 500 mW | 28 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 10 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETICALLY SEALED, GLASS PACKAGE-2 | compliant | ||||||||||||
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1N5544B
Microchip Technology Inc
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$3.1702 | No | Active | 1 mA | 500 mW | 28 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 100 Ω | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/437E | DO-35 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETICALLY SEALED, GLASS PACKAGE-2 | compliant | |||||||||
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JAN1N5544B-1
Microchip Technology Inc
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$5.6862 | No | Active | 1 mA | 500 mW | 28 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | |||||||||||
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JAN1N5544B-1/TR
Microchip Technology Inc
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$5.8626 | No | Active | 1 mA | 10 nA | 500 mW | 28 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 100 Ω | 25.2 V | 5 % | O-LALF-W2 | e0 | MIL-PRF-19500; MIL-STD-750 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | unknown | |||||||||
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1N5544BUR-1
Microsemi Corporation
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$6.6628 | No | Transferred | 1 mA | 500 mW | 28 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | AVALANCHE | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, MLL34, MELF-2 | unknown | |||||||||||||
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1N5544BUR-1
Microchip Technology Inc
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$6.6796 | No | Active | 1 mA | 500 mW | 28 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | AVALANCHE | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, MLL34, MELF-2 | compliant | |||||||||||||
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JANTX1N5544B-1
Microchip Technology Inc
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$7.0617 | No | Active | 1 mA | 500 mW | 28 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | |||||||||||
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JANTX1N5544B-1/TR
Microchip Technology Inc
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$7.2188 | No | Active | 1 mA | 10 nA | 500 mW | 28 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 100 Ω | 25.2 V | 5 % | O-LALF-W2 | e0 | MIL-PRF-19500; MIL-STD-750 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | unknown |