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1N6006BUR
Microchip Technology Inc
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$3.7052 | No | Active | 5 mA | 500 mW | 18 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, MLL34, MELF-2 | compliant | ||||||||
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1N6006BUR/TR
Microchip Technology Inc
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$3.8979 | No | Active | 5 mA | 500 mW | 18 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | TR, 7 INCH; 2000 | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, MLL34, MELF-2 | compliant | EAR99 | 8541.10.00.50 | ||||||
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MX1N6006BUR-1TR
Microsemi Corporation
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Check for Price | No | No | Transferred | 5 mA | 500 mW | 18 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | TR, 7 INCH: 2000 | 5 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500 | DO-213AA | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | O-LELF-R2 | compliant | EAR99 | 8541.10.00.50 | DO-213AA | 2 | ||
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1N6006BUR-1E3TR
Microsemi Corporation
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Check for Price | Transferred | 5 mA | 500 mW | 18 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | TR, 7 INCH: 2000 | 5 % | O-LELF-R2 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROSEMI CORP | O-LELF-R2 | compliant | EAR99 | 8541.10.00.50 | |||||||||||
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MX1N6006BUR
Microsemi Corporation
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Check for Price | No | No | Transferred | 5 mA | 500 mW | 18 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | O-LELF-R2 | compliant | EAR99 | 8541.10.00.50 | DO-213AA | 2 | |||
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MQ1N6006BUR
Microsemi Corporation
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Check for Price | No | No | Transferred | 5 mA | 500 mW | 18 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | O-LELF-R2 | compliant | EAR99 | 8541.10.00.50 | DO-213AA | 2 | |||
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MSP1N6006BUR-1
Microsemi Corporation
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Check for Price | No | No | Transferred | 5 mA | 500 mW | 18 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500 | DO-213AA | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | O-LELF-R2 | compliant | EAR99 | 8541.10.00.50 | DO-213AA | 2 | |||
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MX1N6006BUR-1
Microsemi Corporation
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Check for Price | No | No | Transferred | 5 mA | 500 mW | 18 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500 | DO-213AA | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | O-LELF-R2 | compliant | EAR99 | 8541.10.00.50 | DO-213AA | 2 | |||
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MX1N6006BUR-1E3
Microsemi Corporation
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Check for Price | Yes | Yes | Transferred | 5 mA | 500 mW | 18 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Not Qualified | O-LELF-R2 | e3 | MIL-19500 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WRAP AROUND | END | MICROSEMI CORP | O-LELF-R2 | compliant | EAR99 | 8541.10.00.50 | DO-213AA | 2 | ||||
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1N6006BURE3
Microsemi Corporation
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Check for Price | Transferred | 5 mA | 500 mW | 18 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | O-LELF-R2 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROSEMI CORP | O-LELF-R2 | compliant | EAR99 | 8541.10.00.50 |