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1 - 10 of 26 results
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1N6350US
Microsemi Corporation
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$13.8338 | No | No | Transferred | 1 mA | 500 mW | 120 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 600 Ω | 5 % | Not Qualified | O-LELF-R2 | e0 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, B, D-5D, 2 PIN | 2 | unknown | EAR99 | 8541.10.00.50 | ||||||||
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1N6350US
Microchip Technology Inc
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$15.0825 | No | Active | 1 mA | 500 mW | 120 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 600 Ω | 5 % | Not Qualified | O-LELF-R2 | e0 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, B, D-5D, 2 PIN | compliant | ||||||||||||
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JAN1N6350US
Microchip Technology Inc
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$16.4187 | No | Active | 1 mA | 50 nA | 500 mW | 120 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 600 Ω | 3.2 kΩ | 91 V | 5 % | Qualified | O-LELF-R2 | MIL-19500 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | MELF-2 | compliant | |||||||||
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JAN1N6350US
Microsemi Corporation
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$16.9384 | No | Transferred | 1 mA | 50 nA | 500 mW | 120 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 600 Ω | 3.2 kΩ | 91 V | 5 % | Not Qualified | O-LELF-R2 | MIL-19500 | 175 °C | -65 °C | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROSEMI CORP | MELF-2 | 2 | unknown | EAR99 | 8541.10.00.50 | MELF | ||||||
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JANTX1N6350US
Microchip Technology Inc
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$18.6398 | No | Active | 1 mA | 500 mW | 120 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 5 % | Qualified | O-GELF-R2 | MIL-19500 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | MELF-2 | compliant | |||||||||||||
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JANTX1N6350US/TR
Microchip Technology Inc
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$18.8041 | Active | 1 mA | 500 mW | 120 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 5 % | Qualified | O-GELF-R2 | MIL-19500 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | |||||||||||||
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JANTXV1N6350US
Microchip Technology Inc
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$22.9820 | No | Active | 1 mA | 500 mW | 120 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 5 % | Qualified | O-GELF-R2 | MIL-19500 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | MELF-2 | compliant | |||||||||||||
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JANS1N6350US
Microchip Technology Inc
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$169.8156 | No | Active | 1 mA | 500 mW | 120 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 5 % | Qualified | O-MELF-R2 | e0 | MIL-19500/533 | 175 °C | -65 °C | ISOLATED | 2 | METAL | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, B, MELF-2 | compliant | |||||||||||
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JANS1N6350US
Bkc Semiconductors Inc
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Check for Price | Transferred | 1 mA | 500 mW | 120 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Not Qualified | O-MELF-R2 | MIL-19500/533 | ISOLATED | 2 | METAL | ROUND | LONG FORM | WRAP AROUND | END | BKC SEMICONDUCTORS INC | unknown | ||||||||||||||||||
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JANTXV1N6350US
Bkc Semiconductors Inc
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Check for Price | No | Transferred | 1 mA | 500 mW | 120 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 600 Ω | 5 % | Not Qualified | O-MELF-R2 | e0 | MIL-19500/533 | 175 °C | ISOLATED | 2 | METAL | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | BKC SEMICONDUCTORS INC | unknown |