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1N6641US
Microsemi Corporation
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$9.1749 | No | No | Transferred | 300 mA | 1.1 V | 5 ns | 100 nA | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | 2.5 A | 1 | Not Qualified | O-LELF-R2 | e0 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, D-5D, 2 PIN | 2 | unknown | EAR99 | 8541.10.00.70 | |||||
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1N6641US
Microchip Technology Inc
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$10.0005 | No | Active | 300 mA | 1.1 V | 5 ns | 100 nA | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | 2.5 A | 1 | Not Qualified | O-LELF-R2 | e0 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, D-5D, 2 PIN | compliant | |||||||||
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JAN1N6641US
Microchip Technology Inc
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$10.1998 | No | Active | 300 mA | 5 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | METALLURGICALLY BONDED | 1 | Qualified | O-XELF-R2 | e0 | MIL-19500/609D | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SURFACE MOUNT PACKAGE-2 | compliant | ||||||||||||
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JANTX1N6641US
Microchip Technology Inc
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$11.5152 | No | Active | 300 mA | 1.1 V | 5 ns | 100 nA | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | METALLURGICALLY BONDED | 2.5 A | 1 | Qualified | O-XELF-R2 | e0 | MIL-19500/609D | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SURFACE MOUNT PACKAGE-2 | compliant | |||||||
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JANTX1N6641US/TR
Microchip Technology Inc
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$11.6723 | Active | 300 mA | 1.1 V | 5 ns | 100 nA | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | METALLURGICALLY BONDED | 2.5 A | 1 | Qualified | O-XELF-R2 | e0 | MIL-19500/609D | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.70 | |||||||
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JAN1N6641US
Microsemi Corporation
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$11.8745 | No | No | Transferred | 300 mA | 5 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | METALLURGICALLY BONDED | 1 | Not Qualified | O-XELF-R2 | e0 | MIL-19500/609D | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | SURFACE MOUNT PACKAGE-2 | 2 | unknown | EAR99 | 8541.10.00.70 | ||||||||
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JANTX1N6641US
Microsemi Corporation
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$13.3892 | No | No | Transferred | 300 mA | 1.1 V | 5 ns | 100 nA | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | METALLURGICALLY BONDED | 2.5 A | 1 | Not Qualified | O-XELF-R2 | e0 | MIL-19500/609D | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | SURFACE MOUNT PACKAGE-2 | 2 | unknown | EAR99 | 8541.10.00.70 | |||
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JANTXV1N6641US
Microchip Technology Inc
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$14.3127 | No | Active | 300 mA | 1.1 V | 5 ns | 100 nA | SILICON | RECTIFIER DIODE | SINGLE | YES | 50 V | 1 | METALLURGICALLY BONDED | 2.5 A | 1 | Qualified | O-XELF-R2 | e0 | MIL-19500/609D | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SURFACE MOUNT PACKAGE-2 | compliant | ||||||
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JANTXV1N6641US
Microsemi Corporation
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$16.6430 | No | No | Transferred | 300 mA | 1.1 V | 5 ns | 100 nA | SILICON | RECTIFIER DIODE | SINGLE | YES | 50 V | 1 | METALLURGICALLY BONDED | 2.5 A | 1 | Not Qualified | O-XELF-R2 | e0 | MIL-19500/609D | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | SURFACE MOUNT PACKAGE-2 | 2 | not_compliant | EAR99 | 8541.10.00.70 | ||
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JANS1N6641US
Microchip Technology Inc
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$86.5212 | No | Active | 300 mA | 1.1 V | 5 ns | 100 nA | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | METALLURGICALLY BONDED | 2.5 A | 1 | Qualified | O-XELF-R2 | e0 | MIL-19500/609D | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SURFACE MOUNT PACKAGE-2 | compliant |