Filter Your Search
1 - 10 of 51 results
|
JAN1N751A-1
Microchip Technology Inc
|
$2.1118 | No | Active | 20 mA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/127 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | Microchip | |||||||||
|
1N751A-1
Microchip Technology Inc
|
$2.2447 | No | Active | 20 mA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | Microchip | ||||||||||
|
JAN1N751A-1/TR
Microchip Technology Inc
|
$2.2511 | No | Active | 75 mA | 5 µA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 14 Ω | 2 V | 1.53 mV/°C | 5 % | O-LALF-W2 | e0 | MIL-PRF-19500; MIL-STD-750 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | |||||||
|
JAN1N751A-1
Cobham Semiconductor Solutions
|
$2.3900 | Transferred | 20 mA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Not Qualified | O-LELF-R2 | MIL | DO-213AA | 200 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | AEROFLEX/METELICS INC | unknown | EAR99 | 8541.10.00.50 | ||||||||||||||
|
1N751A-1/TR
Microchip Technology Inc
|
$2.4211 | No | Active | 20 mA | 480 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 17 Ω | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AH | 1 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | EAR99 | 8541.10.00.50 | ||||||||
|
1N751A-1E3
Microchip Technology Inc
|
$2.4374 | Yes | Active | 20 mA | 480 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e3 | DO-204AH | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | ROHS COMPLIANT, HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | Microchip | ||||||||||||
|
JANTX1N751A-1
Microchip Technology Inc
|
$2.4503 | No | Active | 20 mA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/127 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | Microchip | |||||||||
|
JANTX1N751A-1
Microsemi Corporation
|
$2.4580 | No | Transferred | 20 mA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/127 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | not_compliant | Microsemi Corporation | |||||||||
|
JANTX1N751A-1/TR
Microchip Technology Inc
|
$2.5824 | No | Active | 75 mA | 5 µA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 14 Ω | 2 V | 1.53 mV/°C | 5 % | O-LALF-W2 | e0 | MIL-PRF-19500; MIL-STD-750 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | unknown | EAR99 | 8541.10.00.50 | |||||
|
JANTXV1N751A-1
Microchip Technology Inc
|
$7.3873 | No | Active | 20 mA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/127 | DO-35 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | Microchip |