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1N759A
SPC Multicomp
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$0.0391 | Active | 20 mA | 500 mW | 12 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | HIGH RELIABILITY | 5 % | O-LALF-W2 | DO-35 | 200 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MULTICOMP PRO | GLASS PACAKGE-2 | unknown | EAR99 | 8541.10.00.50 | |||||||||||||||
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1N759A-1
Microsemi Corporation
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$2.0202 | No | No | Transferred | 20 mA | 500 mW | 12 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | not_compliant | EAR99 | 8541.10.00.50 | Microsemi Corporation | ||||||||
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JAN1N759A-1
Microchip Technology Inc
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$2.0997 | No | Active | 20 mA | 500 mW | 12 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/127 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | |||||||||||
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1N759A-1
Microchip Technology Inc
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$2.2218 | No | Active | 20 mA | 500 mW | 12 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | Microchip | |||||||||||
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1N759
Microchip Technology Inc
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$2.2218 | No | Active | 20 mA | 500 mW | 12 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 30 Ω | 10 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 1 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | Microchip | ||||||||||
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JAN1N759A-1/TR
Microchip Technology Inc
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$2.2511 | No | Active | 35 mA | 1 µA | 500 mW | 12 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 10 Ω | 9 V | 9.6 mV/°C | 5 % | O-LALF-W2 | e0 | MIL-PRF-19500; MIL-STD-750 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | ||||||||
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JANTX1N759A-1
Microchip Technology Inc
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$2.4503 | No | Active | 20 mA | 500 mW | 12 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/127 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | |||||||||||
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JANTX1N759A-1/TR
Microchip Technology Inc
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$2.5824 | No | Active | 35 mA | 1 µA | 500 mW | 12 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 10 Ω | 9 V | 9.6 mV/°C | 5 % | O-LALF-W2 | MIL-PRF-19500; MIL-STD-750 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | ||||||||||
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1N759AUR-1
Microsemi Corporation
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$2.9526 | No | Transferred | 20 mA | 400 mW | 12 V | SILICON | ZENER DIODE | SINGLE | YES | 1 | ZENER | 30 Ω | 5 % | e0 | 175 °C | TIN LEAD | MICROSEMI CORP | unknown | Microsemi Corporation | ||||||||||||||||||||||||
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1N759AUR-1
Microchip Technology Inc
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$3.1159 | No | Active | 20 mA | 1 µA | 400 mW | 12 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 10 Ω | 9 V | 5 % | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | MELF-2 | compliant | Microchip |