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1N827A
Microchip Technology Inc
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$7.4081 | No | Active | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.062 mV/°C | 4.84 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant | ||||||||||||||
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1N827A/TR
Microchip Technology Inc
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$7.5881 | Active | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.062 mV/°C | 4.84 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | ||||||||||||||
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1N827A-1
Microchip Technology Inc
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$7.6631 | No | Active | 7.5 mA | 2 µA | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 10 Ω | 3 V | 0.062 mV/°C | 5 % | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 1 | 175 °C | -55 °C | 260 | 40 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | |||||||
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1N827AE3
Microchip Technology Inc
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$7.8623 | Yes | Active | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.062 mV/°C | 4.84 % | O-LALF-W2 | e3 | DO-204AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant | Microchip | ||||||||||||||||
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1N827A-1/TR
Microchip Technology Inc
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$7.8623 | No | Active | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.062 mV/°C | 4.84 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant | EAR99 | 8541.10.00.50 | |||||||||||||
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1N827A-1E3
Microchip Technology Inc
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$7.9473 | Yes | Active | 7.5 mA | 2 µA | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 10 Ω | 3 V | 0.062 mV/°C | 5 % | O-LALF-W2 | e3 | MIL-19500 | DO-204AH | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | ||||||||||
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1N827A-1E3/TR
Microchip Technology Inc
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$8.0544 | Yes | Active | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.062 mV/°C | 4.84 % | O-LALF-W2 | e3 | DO-204AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant | EAR99 | 8541.10.00.50 | |||||||||||||||
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1N827AUR
Microchip Technology Inc
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$10.6004 | No | Active | 7.5 mA | 500 mW | 6.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 10 Ω | 0.062 mV/°C | 4.84 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | |||||||||||||
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1N827AUR-1
Microchip Technology Inc
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$10.6004 | No | Active | 7.5 mA | 2 µA | 500 mW | 6.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 10 Ω | 3 V | 0.06 mV/°C | 5 % | O-LELF-R2 | e0 | MIL-STD-750 | DO-213AA | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, SIMILAR TO DO-213AA, 2 PIN | compliant | |||||||||
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1N827AUR-1/TR
Microchip Technology Inc
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$10.7954 | No | Active | 7.5 mA | 500 mW | 6.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | TR, 7 INCH; 2000 | 10 Ω | 0.062 mV/°C | 4.84 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | EAR99 | 8541.10.00.50 |