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1 - 10 of 1,006 results
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1N965B
Fairchild Semiconductor Corporation
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$0.0506 | Yes | Obsolete | 8.5 mA | 500 mW | 15 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 16 Ω | 5 % | Not Qualified | O-LALF-W2 | e3 | DO-35 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | FAIRCHILD SEMICONDUCTOR CORP | DO-35 | GLASS PACKAGE-2 | 2 | unknown | EAR99 | 8541.10.00.50 | ||||||||||||
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JAN1N965B-1
Microchip Technology Inc
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$1.9668 | No | Active | 8.5 mA | 500 nA | 400 mW | 15 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 16 Ω | 700 Ω | 11 V | 12.3 mV/°C | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | Microchip | ||||||||
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1N965B
Microsemi Corporation
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$2.0593 | No | No | Transferred | 8.5 mA | 417 mW | 15 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-7 | HERMETIC SEALED, GLASS, DO-7, 2 PIN | 2 | not_compliant | EAR99 | 8541.10.00.50 | Microsemi Corporation | |||||||||
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1N965B
Microchip Technology Inc
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$2.1453 | No | Active | 8.5 mA | 417 mW | 15 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant | Microchip | ||||||||||||||
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JAN1N965B-1/TR
Microchip Technology Inc
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$2.1453 | No | Active | 8.5 mA | 500 nA | 400 mW | 15 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 16 Ω | 700 Ω | 11 V | 12.3 mV/°C | 5 % | O-LALF-W2 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | ||||||||||||
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1N965A
Microchip Technology Inc
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$2.1468 | No | Active | 8.5 mA | 500 mW | 15 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 10 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETICALLY SEALED, GLASS PACKAGE-2 | compliant | |||||||||||||||||
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1N965B-1
Microchip Technology Inc
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$2.1511 | No | Active | 8.5 mA | 500 nA | 400 mW | 15 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 16 Ω | 700 Ω | 11 V | 12.3 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | Microchip | |||||||||
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JANTX1N965B-1
Microchip Technology Inc
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$2.3111 | No | Active | 8.5 mA | 500 nA | 400 mW | 15 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 16 Ω | 700 Ω | 11 V | 12.3 mV/°C | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | Microchip | ||||||||
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1N965B-1/TR
Microchip Technology Inc
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$2.3211 | No | Active | 8.5 mA | 500 nA | 400 mW | 15 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 16 Ω | 700 Ω | 11 V | 12.3 mV/°C | 5 % | O-LALF-W2 | e0 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | |||||||||||
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JANTX1N965B-1
Microsemi Corporation
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$2.3387 | No | No | Transferred | 8.5 mA | 500 mW | 15 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/117 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-35 | HERMETICALLY SEALED, GLASS PACKAGE-2 | 1 | not_compliant | EAR99 | 8541.10.00.50 | Microsemi Corporation |