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Manufacturer Part Number: 1n4130ur
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1N4130UR-1
 Microsemi Corporation 		$3.6908 No No Transferred 250 µA 500 mW 68 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER METALLURGICALLY BONDED 700 Ω 5 % Not Qualified O-LELF-R2 e0 DO-213AA 1 200 °C ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WRAP AROUND END MICROSEMI CORP DO-213AA HERMETIC SEALED, GLASS, SOD-80, LL34, MELF-2 2 unknown EAR99 8541.10.00.50
1N4130UR
 Microsemi Corporation 		$3.6908 No No Transferred 250 µA 500 mW 68 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER METALLURGICALLY BONDED 700 Ω 5 % Not Qualified O-LELF-R2 e0 DO-213AA 1 175 °C ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WRAP AROUND END MICROSEMI CORP DO-213AA HERMETIC SEALED, GLASS, MLL34, MELF-2 2 not_compliant EAR99 8541.10.00.50
1N4130UR
 Microchip Technology Inc 		$3.9108 No Active 250 µA 500 mW 68 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER METALLURGICALLY BONDED 700 Ω 5 % Not Qualified O-LELF-R2 e0 DO-213AA 1 175 °C ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WRAP AROUND END MICROCHIP TECHNOLOGY INC HERMETIC SEALED, GLASS, MLL34, MELF-2 compliant Microchip
1N4130UR-1
 Microchip Technology Inc 		$3.9108 No Active 250 µA 500 mW 68 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER METALLURGICALLY BONDED 700 Ω 5 % Not Qualified O-LELF-R2 e0 DO-213AA 1 200 °C ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WRAP AROUND END MICROCHIP TECHNOLOGY INC HERMETIC SEALED, GLASS, SOD-80, LL34, MELF-2 compliant Microchip
JAN1N4130UR-1
 Microchip Technology Inc 		$4.2379 No Active 250 µA 10 nA 500 mW 68 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER METALLURGICALLY BONDED 64.6 mV/°C 5 % Qualified O-LELF-R2 e0 MIL-19500/435F DO-213AA 1 200 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WRAP AROUND END MICROCHIP TECHNOLOGY INC DO-213AA, 2 PIN compliant Microchip
JANTX1N4130UR-1
 MACOM 		$9.1041 Transferred 250 µA 500 mW 68 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER METALLURGICALLY BONDED 5 % Qualified O-LELF-R2 MIL-19500/435F DO-213AA ISOLATED 2 GLASS ROUND LONG FORM WRAP AROUND END M/A-COM TECHNOLOGY SOLUTIONS INC DO-213AA, 2 PIN compliant EAR99 8541.10.00.50 MACOM
JAN1N4130UR-1
 Microsemi Corporation 		$10.4672 No Transferred 250 µA 10 nA 500 mW 68 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER METALLURGICALLY BONDED 64.6 mV/°C 5 % Not Qualified O-LELF-R2 e0 MIL-19500/435F DO-213AA 1 200 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WRAP AROUND END MICROSEMI CORP DO-213AA, 2 PIN unknown
JANTX1N4130UR-1
 Microchip Technology Inc 		$11.2660 No Active 250 µA 10 nA 500 mW 68 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER METALLURGICALLY BONDED 700 Ω 64.6 mV/°C 5 % Qualified O-LELF-R2 e0 MIL-19500/435F DO-213AA 1 200 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WRAP AROUND END MICROCHIP TECHNOLOGY INC DO-213AA, 2 PIN compliant Microchip
JANTXV1N4130UR-1
 Microchip Technology Inc 		$11.5960 No Active 250 µA 10 nA 500 mW 68 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER METALLURGICALLY BONDED 700 Ω 64.6 mV/°C 5 % Qualified O-LELF-R2 e0 MIL-19500/435F DO-213AA 200 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WRAP AROUND END MICROCHIP TECHNOLOGY INC DO-213AA, 2 PIN compliant Microchip
JANTX1N4130UR-1
 Microsemi Corporation 		$11.9060 No No Transferred 250 µA 10 nA 500 mW 68 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER METALLURGICALLY BONDED 700 Ω 64.6 mV/°C 5 % Not Qualified O-LELF-R2 e0 MIL-19500/435F DO-213AA 1 200 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WRAP AROUND END MICROSEMI CORP DO-213AA DO-213AA, 2 PIN 2 unknown EAR99 8541.10.00.50 Microsemi Corporation
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