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1 - 10 of 620 results
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1N4372A
Microsemi Corporation
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$2.7778 | No | Transferred | 20 mA | 500 mW | 3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 29 Ω | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 1 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-7 | HERMETIC SEALED, GLASS PACKAGE-2 | 2 | unknown | EAR99 | 8541.10.00.50 | Microsemi Corporation | |||||||
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JAN1N4372A-1
Microchip Technology Inc
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$3.0059 | No | Active | 20 mA | 500 mW | 3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/127 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||||||
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1N4372
Microchip Technology Inc
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$3.1903 | No | Active | 20 mA | 500 mW | 3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 29 Ω | 10 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 1 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | Microchip | |||||||||||
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JAN1N4372A-1
Microsemi Corporation
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$3.8082 | No | No | Transferred | 20 mA | 500 mW | 3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/127 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-35 | HERMETIC SEALED, GLASS PACKAGE-2 | 1 | unknown | EAR99 | 8541.10.00.50 | Microsemi Corporation | ||||||||
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JAN1N4372AUR-1
Microchip Technology Inc
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$5.1941 | No | Active | 20 mA | 30 µA | 500 mW | 3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 29 Ω | 1 V | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | MELF-2 | compliant | |||||||||
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JANTX1N4372A-1
MACOM
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$5.7895 | Transferred | 20 mA | 500 mW | 3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | MIL-19500/127 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | M/A-COM TECHNOLOGY SOLUTIONS INC | HERMETIC SEALED, GLASS PACKAGE-1 | compliant | EAR99 | 8541.10.00.50 | |||||||||||||||
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JANTX1N4372AUR-1
Microchip Technology Inc
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$6.1882 | No | Active | 20 mA | 30 µA | 500 mW | 3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 29 Ω | 1 V | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | MELF-2 | compliant | |||||||||
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JANTX1N4372AUR-1
MACOM
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$6.7008 | Transferred | 20 mA | 500 mW | 3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | MIL-19500/127 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | M/A-COM TECHNOLOGY SOLUTIONS INC | HERMETIC SEALED, GLASS, LL34, MELF-2 | compliant | EAR99 | 8541.10.00.50 | |||||||||||||||
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JAN1N4372AUR-1
Microsemi Corporation
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$6.8718 | No | Transferred | SILICON | ZENER DIODE | Not Qualified | e0 | Tin/Lead (Sn/Pb) | MICROSEMI CORP | unknown | EAR99 | 8541.10.00.50 | Microsemi Corporation | ||||||||||||||||||||||||||||||||
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JANTX1N4372A-1
Microsemi Corporation
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$7.2335 | No | No | Transferred | 20 mA | 500 mW | 3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/127 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-35 | HERMETIC SEALED, GLASS PACKAGE-2 | 1 | unknown | EAR99 | 8541.10.00.50 | Microsemi Corporation |