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JAN1N4493US
Microchip Technology Inc
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$14.7883 | No | Active | 1.7 mA | 1.5 W | 150 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | |||||||||||||
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1N4493US
Microsemi Corporation
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$14.9940 | No | Transferred | 1.7 mA | 1.5 W | 150 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | O-LELF-R2 | e0 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | |||||||||||||||
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JANTX1N4493US
Microchip Technology Inc
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$15.5139 | No | Active | 1.7 mA | 1.5 W | 150 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | |||||||||||||
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1N4493US
Microchip Technology Inc
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$16.3337 | No | Active | 1.7 mA | 1.5 W | 150 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | O-LELF-R2 | e0 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | ||||||||||||||||
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JAN1N4493US
Microsemi Corporation
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$17.9860 | No | No | Transferred | 1.7 mA | 1.5 W | 150 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | 2 | EAR99 | 8541.10.00.50 | |||||||||
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JANTXV1N4493US
Microchip Technology Inc
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$18.4316 | No | Active | 1.7 mA | 1.5 W | 150 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | |||||||||||||
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JANTXV1N4493US
Microsemi Corporation
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$20.5321 | No | Transferred | 1.7 mA | 1.5 W | 150 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | |||||||||||||
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JANTXV1N4493US
Semtech Corporation
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$49.5422 | Transferred | 1.7 mA | 1.5 W | 150 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 700 Ω | 5 % | Qualified | O-LELF-R2 | MIL-19500/406 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | SEMTECH CORP | HERMETIC SEALED PACKAGE-2 | unknown | 2 | EAR99 | 8541.10.00.50 | ||||||||||||
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JANS1N4493US
Microchip Technology Inc
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$131.1460 | No | Active | 1.7 mA | 1.5 W | 150 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | |||||||||||||
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JAN1N4493US
Micross Components
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Check for Price | Active | 1.7 mA | 250 nA | 1.5 W | 150 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 700 Ω | 6 kΩ | 120 V | 150 mV/°C | 5 % | O-LELF-R2 | MIL-19500 | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROSS COMPONENTS | compliant |