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1N4566A
Microchip Technology Inc
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$4.3171 | No | Active | 500 µA | 475 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 0.32 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | Microchip | ||||||||||
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1N4566AE3
Microchip Technology Inc
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$4.5164 | Yes | Active | 500 µA | 500 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.32 mV/°C | 5 % | O-LALF-W2 | e3 | DO-204AH | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | Microchip | ||||||||||
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1N4566A-1
Microchip Technology Inc
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$5.6862 | No | Active | 500 µA | 475 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 200 Ω | 0.32 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/452G | DO-35 | 100 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant | Microchip | ||||||
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JAN1N4566A-1
Microchip Technology Inc
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$7.5781 | No | Active | 500 µA | 500 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 0.32 mV/°C | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/452G | DO-35 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant | EAR99 | 8541.10.00.50 | ||||
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JAN1N4566A-1/TR
Microchip Technology Inc
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$7.7294 | Active | 500 µA | 500 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 0.32 mV/°C | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/452G | DO-35 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | ||||||
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JANTX1N4566A-1
Microchip Technology Inc
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$7.8844 | No | Active | 500 µA | 500 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 0.32 mV/°C | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/452G | DO-35 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant | Microchip | EAR99 | 8541.10.00.50 | |||
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1N4566AUR-1
Microchip Technology Inc
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$7.9758 | No | Active | 500 µA | 500 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 200 Ω | 0.32 mV/°C | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 1 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, LL34, MELF-2 | compliant | |||||||
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JANTXV1N4566A-1
Microchip Technology Inc
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$8.3451 | No | Active | 500 µA | 500 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 0.32 mV/°C | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/452G | DO-35 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant | EAR99 | 8541.10.00.50 | ||||
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JANTXV1N4566A-1/TR
Microchip Technology Inc
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$8.5051 | Active | 500 µA | 500 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 0.32 mV/°C | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/452G | DO-35 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | ||||||
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JAN1N4566AUR-1
Microchip Technology Inc
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$10.9254 | No | Active | 500 µA | 500 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/452 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, LL34, MELF-2 | compliant |