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1N4567A-1
Microchip Technology Inc
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$4.0558 | No | Active | 500 µA | 475 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 0.13 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/452G | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant | |||||||||
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1N4567A-1/TR
Microchip Technology Inc
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$4.2071 | Active | 500 µA | 2 µA | 500 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 3 V | 0.13 mV/°C | 1 % | O-LALF-W2 | MIL-STD-750 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | EAR99 | 8541.10.00.50 | ||||||||
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1N4567A
Microchip Technology Inc
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$4.2071 | No | Active | 500 µA | 475 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.13 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AH | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | ||||||||||
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1N4567E3
Microchip Technology Inc
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$4.2071 | Yes | Active | 500 µA | 500 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.128 mV/°C | 5 % | O-LALF-W2 | e3 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | compliant | ||||||||||
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1N4567-1
Microchip Technology Inc
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$4.2071 | No | Active | 500 µA | 475 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 200 Ω | 0.13 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AH | 75 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | ||||||||
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1N4567AE3
Microchip Technology Inc
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$4.2071 | Yes | Active | 500 µA | 500 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.128 mV/°C | 5 % | O-LALF-W2 | e3 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | compliant | ||||||||||
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1N4567
Microchip Technology Inc
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$4.2071 | No | Active | 500 µA | 475 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.13 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AH | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | ||||||||||
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1N4567A/TR
Microchip Technology Inc
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$4.3958 | No | Active | 500 µA | 2 µA | 500 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 3 V | 0.13 mV/°C | 1 % | O-LALF-W2 | MIL-STD-750 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | EAR99 | 8541.10.00.50 | |||||||
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1N4567E3/TR
Microchip Technology Inc
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$4.3958 | Active | 500 mW | 6.4 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.128 mV/°C | 5 % | O-LALF-W2 | e3 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | |||||||||||
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JAN1N4567A-1
Microchip Technology Inc
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$6.4619 | No | Active | 500 µA | 500 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 0.128 mV/°C | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/452 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant |