Parametric results for: 1n4570 under Zener Diodes
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JAN1N4570A-1
Microchip Technology Inc
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$3.5765 | No | Active | 1 mA | 500 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 0.64 mV/°C | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/452G | DO-35 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | not_compliant | EAR99 | 8541.10.00.50 | |||||||||
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1N4570-1
Microsemi Corporation
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$3.6908 | No | No | Transferred | 1 mA | 500 mW | 6.4 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 100 Ω | 0.64 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AH | 75 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS, DO-35, 2 PIN | unknown | EAR99 | 8541.10.00.50 | DO-35 | 2 | Microsemi Corporation | ||||||||
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1N4570A-1
Microsemi Corporation
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$3.6908 | No | No | Transferred | 500 mW | 6.4 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 0.64 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/452G | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS, DO-7, 2 PIN | unknown | EAR99 | 8541.10.00.50 | DO-7 | 2 | Microsemi Corporation | ||||||||||
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1N4570
Microchip Technology Inc
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$3.7052 | No | Active | 500 µA | 475 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.64 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | |||||||||||||
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1N4570-1
Microchip Technology Inc
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$3.7052 | No | Active | 1 mA | 475 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 100 Ω | 0.64 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AH | 75 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | |||||||||||||
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1N4570A/TR
Microchip Technology Inc
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$3.8979 | Active | 500 µA | 2 µA | 500 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 3 V | 0.64 mV/°C | 1 % | O-LALF-W2 | MIL-STD-750 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | EAR99 | 8541.10.00.50 | |||||||||||||
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1N4570A
Microchip Technology Inc
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$3.8979 | No | Active | 1 mA | 475 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 0.64 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||||||||
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1N4570A-1
Microchip Technology Inc
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$3.8979 | No | Active | 1 mA | 475 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 0.64 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/452G | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant | Microchip | |||||||||||||
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JAN1N4570A-1
Microsemi Corporation
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$5.2336 | No | No | Transferred | 500 mW | 6.4 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 0.64 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/452G | DO-35 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | O-LALF-W2 | not_compliant | EAR99 | 8541.10.00.50 | DO-7 | 2 | ||||||||
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JAN1N4570AUR-1
Microchip Technology Inc
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$5.3891 | No | Active | 1 mA | 500 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/452 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, LL34, MELF-2 | compliant |