Parametric results for: 1n5712 under Rectifier Diodes
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1N5712-1
Microchip Technology Inc
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$4.8185 | No | Active | 75 mA | SILICON | RECTIFIER DIODE | SINGLE | NO | 1 | SCHOTTKY | METALLURGICALLY BONDED | 1 | Not Qualified | O-LALF-W2 | e0 | MIL-S-19500/445 | DO-35 | 150 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | |||||||||||||||||
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1N5712-1/TR
Microchip Technology Inc
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$4.9641 | No | Active | 75 mA | 1 V | 150 nA | SILICON | 20 V | RECTIFIER DIODE | SINGLE | NO | 1 | SCHOTTKY | GENERAL PURPOSE | 1 | 16 V | O-LALF-W2 | DO-35 | 150 °C | -65 °C | NOT SPECIFIED | NOT SPECIFIED | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8541.10.00.70 | ||||||||||||||
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JANHCA1N5712
Microchip Technology Inc
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$5.4684 | No | Active | 75 mA | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | METALLURGICALLY BONDED | 1 | Qualified | S-XUUC-N2 | e0 | CATHODE | 2 | UNSPECIFIED | SQUARE | UNCASED CHIP | Tin/Lead (Sn/Pb) | NO LEAD | UPPER | MICROCHIP TECHNOLOGY INC | compliant | |||||||||||||||||||||||
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JAN1N5712-1
Microchip Technology Inc
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$5.6441 | No | Active | 75 mA | 1 V | 150 nA | SILICON | 20 V | RECTIFIER DIODE | SINGLE | NO | 16 V | 1 | SCHOTTKY | HIGH RELIABILITY | GENERAL PURPOSE | 1 | 16 V | Qualified | O-LALF-W2 | e0 | MIL-PRF-19500; MIL-STD-750 | DO-204AH | 150 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | |||||||||||
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JAN1N5712-1/TR
Microchip Technology Inc
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$5.8026 | No | Active | 75 mA | 1 V | 150 nA | SILICON | 20 V | RECTIFIER DIODE | SINGLE | NO | 16 V | 1 | SCHOTTKY | HIGH RELIABILITY | GENERAL PURPOSE | 1 | 16 V | O-LALF-W2 | e0 | MIL-PRF-19500; MIL-STD-750 | DO-204AH | 150 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | ||||||||||||
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1N5712-1
Microsemi Corporation
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$6.3131 | No | No | Transferred | 75 mA | SILICON | RECTIFIER DIODE | SINGLE | NO | 1 | SCHOTTKY | METALLURGICALLY BONDED | 1 | Not Qualified | O-LALF-W2 | e0 | MIL-S-19500/445 | DO-35 | 150 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | EAR99 | 8541.10.00.70 | Microsemi Corporation | |||||||||||||
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1N5712-1E3
Microchip Technology Inc
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$6.4182 | Yes | Active | 75 mA | 1 V | 150 nA | SILICON | 20 V | RECTIFIER DIODE | SINGLE | NO | 16 V | 1 | SCHOTTKY | HIGH RELIABILITY | GENERAL PURPOSE | 1 | 16 V | O-LALF-W2 | MIL-STD-750 | DO-204AH | 150 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | ROHS COMPLIANT, HERMETIC SEALED, DO-35, GLASS PACKAGE-2 | compliant | ||||||||||||||
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JANTX1N5712-1
Microchip Technology Inc
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$8.5651 | No | Active | 75 mA | 1 V | 150 nA | SILICON | 20 V | RECTIFIER DIODE | SINGLE | NO | 16 V | 1 | SCHOTTKY | HIGH RELIABILITY | GENERAL PURPOSE | 1 | 16 V | Qualified | O-LALF-W2 | e0 | MIL-PRF-19500; MIL-STD-750 | DO-204AH | 150 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | |||||||||||
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1N5712UR-1
Microsemi Corporation
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$9.2999 | No | No | Transferred | 75 mA | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | SCHOTTKY | METALLURGICALLY BONDED | 1 | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, LEADLESS, GLASS, LL34, MELF-2 | unknown | EAR99 | 8541.10.00.70 | Microsemi Corporation | DO-213AA | 2 | |||||||||||||
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JANTX1N5712-1
Microsemi Corporation
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$9.4148 | No | No | Transferred | 75 mA | SILICON | RECTIFIER DIODE | SINGLE | NO | 16 V | 1 | SCHOTTKY | METALLURGICALLY BONDED | 1 | Not Qualified | O-LALF-W2 | e0 | MIL-19500/444 | DO-35 | 150 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | not_compliant | EAR99 | 8541.10.00.70 | Microsemi Corporation | DO-35 | 2 |