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JAN1N5806URS
Microchip Technology Inc
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$19.4281 | No | Active | 1 A | 25 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 150 V | 1 | HIGH RELIABILITY | GENERAL PURPOSE | 1 | Qualified | O-LELF-R2 | e0 | MIL-19500 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, MELF-2 | compliant | |||||||||||||||
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JANTX1N5806URS
Microchip Technology Inc
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$21.9692 | No | Active | 1 A | 25 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 150 V | 1 | HIGH RELIABILITY | GENERAL PURPOSE | 1 | Qualified | O-LELF-R2 | e0 | MIL-19500 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, MELF-2 | compliant | |||||||||||||||
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JANTXV1N5806URS
Microchip Technology Inc
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$27.8741 | No | Active | 1 A | 25 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 150 V | 1 | HIGH RELIABILITY | GENERAL PURPOSE | 1 | Qualified | O-LELF-R2 | e0 | MIL-19500 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, MELF-2 | compliant | |||||||||||||||
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1N5806URS
Microchip Technology Inc
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$32.3165 | No | Active | 1 A | 875 mV | 25 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 150 V | 1 | HIGH RELIABILITY | GENERAL PURPOSE | 35 A | 1 | O-LELF-R2 | e0 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, MELF-2 | unknown | |||||||||||||||
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JANS1N5806URS
Microchip Technology Inc
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$118.1339 | No | Active | 1 A | 25 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 150 V | 1 | HIGH RELIABILITY | GENERAL PURPOSE | 1 | Qualified | O-LELF-R2 | e0 | MIL-19500 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, MELF-2 | compliant | |||||||||||||||
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JANTXV1N5806URS
Microsemi Corporation
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Check for Price | No | Transferred | 1 A | 25 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 150 V | 1 | HIGH RELIABILITY | GENERAL PURPOSE | 1 | Not Qualified | O-LELF-R2 | e0 | MIL-19500 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, MELF-2 | compliant | MELF | 2 | EAR99 | 8541.10.00.80 | |||||||||||
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JANTXV1N5806URS
Defense Logistics Agency
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Check for Price | Active | 1 A | 25 ns | SILICON | 160 V | RECTIFIER DIODE | SINGLE | YES | 150 V | 1 | GENERAL PURPOSE | 1 | 150 V | Qualified | O-LELF-R2 | MIL-19500 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | DEFENSE LOGISTICS AGENCY | unknown | ||||||||||||||||||||
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JANTX1N5806URS
Microsemi Corporation
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Check for Price | No | No | Transferred | 1 A | 25 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 150 V | 1 | HIGH RELIABILITY | GENERAL PURPOSE | 1 | Not Qualified | O-LELF-R2 | e0 | MIL-19500 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, MELF-2 | unknown | MELF | 2 | EAR99 | 8541.10.00.80 | Microsemi Corporation | |||||||||
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1N5806URSE3
Microsemi Corporation
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Check for Price | Yes | Transferred | 1 A | 875 mV | 25 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 150 V | 1 | AVALANCHE | HIGH RELIABILITY | GENERAL PURPOSE | 35 A | 1 | O-LELF-R2 | 175 °C | -65 °C | NOT SPECIFIED | NOT SPECIFIED | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROSEMI CORP | ROHS COMPLIANT, HERMETIC SEALED, GLASS, A, MELF-2 | compliant | EAR99 | 8541.10.00.80 | ||||||||||||
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JAN1N5806URS
Microsemi Corporation
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Check for Price | No | Transferred | 1 A | 25 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 150 V | 1 | HIGH RELIABILITY | GENERAL PURPOSE | 1 | Not Qualified | O-LELF-R2 | e0 | MIL-19500 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, MELF-2 | compliant | MELF | 2 | EAR99 | 8541.10.00.80 | Microsemi Corporation |