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1N6309US
Microchip Technology Inc
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$15.2239 | No | Active | 20 mA | 500 mW | 2.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 30 Ω | 5 % | Not Qualified | O-LELF-R2 | e0 | 150 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, B, D-5D, 2 PIN | compliant | Microchip | ||||||||||
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JAN1N6309US
Microchip Technology Inc
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$15.7481 | No | Active | 20 mA | 100 µA | 500 mW | 2.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 30 Ω | 1.2 kΩ | 1 V | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | MELF-2 | compliant | ||||||
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JANTX1N6309US
Microchip Technology Inc
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$21.5607 | No | Active | 20 mA | 500 mW | 2.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Qualified | O-XELF-R2 | e0 | MIL-19500/533F | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | ||||||||||||
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JANTXV1N6309US
Microchip Technology Inc
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$22.2885 | No | Active | 20 mA | 500 mW | 2.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | MELF-2 | compliant | ||||||||||
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JANS1N6309US
Microchip Technology Inc
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$140.1783 | No | Active | 20 mA | 100 µA | 500 mW | 2.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 30 Ω | 1.2 kΩ | 1 V | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | MELF-2 | compliant | ||||||
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JAN1N6309US
Defense Logistics Agency
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Check for Price | Active | 20 mA | 500 mW | 2.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Qualified | O-LELF-R2 | MIL-19500/533F | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | DEFENSE LOGISTICS AGENCY | unknown | |||||||||||||||||
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1N6309USE3
Microsemi Corporation
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Check for Price | Yes | Transferred | 20 mA | 500 mW | 2.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 30 Ω | 5 % | O-LELF-R2 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | PURE MATTE TIN | WRAP AROUND | END | MICROSEMI CORP | O-LELF-R2 | compliant | EAR99 | 8541.10.00.50 | ||||||||||
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JANS1N6309US
Defense Logistics Agency
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Check for Price | Active | 20 mA | 500 mW | 2.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Qualified | O-LELF-R2 | MIL-19500/533F | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | DEFENSE LOGISTICS AGENCY | unknown | |||||||||||||||||
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JAN1N6309US
VPT Components
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Check for Price | No | Active | 20 mA | 100 µA | 500 mW | 2.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | HIGH RELIABILITY | 30 Ω | 1.2 kΩ | 1 V | -2.04 mV/°C | 5 % | Qualified | O-LELF-R2 | e0 | MIL-PRF-19500; MIL-STD-750 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | VPT COMPONENTS | MELF-2 | unknown | EAR99 | 8541.10.00.50 | |||
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1N6309US
VPT Components
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Check for Price | No | Active | 20 mA | 100 µA | 500 mW | 2.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | HIGH RELIABILITY | 30 Ω | 1.2 kΩ | 1 V | -2.04 mV/°C | 5 % | O-LELF-R2 | e0 | MIL-STD-750 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | VPT COMPONENTS | MELF-2 | unknown | EAR99 | 8541.10.00.50 |