Findchips: Parametric Search Results for 1n6640us,

Parametric results for: 1n6640us, under Rectifier Diodes

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		JAN1N6640US Microchip Technology Inc
		1N6640US Microsemi Corporation
		JANTX1N6640US Microchip Technology Inc
		JANTX1N6640US/TR Microchip Technology Inc
		1N6640US Microchip Technology Inc
		JANTX1N6640US Cobham Semiconductor Solutions
		JANTX1N6640US MACOM
		MNS1N6640US/TR Microchip Technology Inc
		JANTXV1N6640US Microchip Technology Inc
		JANTXV1N6640US/TR Microchip Technology Inc

				Most Relevant											Technical					Compliance				Operating Conditions				Physical								Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Output Current-Max	Forward Voltage-Max (VF)	Reverse Recovery Time-Max	Reverse Current-Max	Diode Element Material	Breakdown Voltage-Min	Diode Type	Configuration	Surface Mount	Rep Pk Reverse Voltage-Max	Number of Elements	Additional Feature	Application	Non-rep Pk Forward Current-Max	Number of Phases	Reverse Test Voltage	Qualification Status	JESD-30 Code	JESD-609 Code	Reference Standard	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Case Connection	Number of Terminals	Package Body Material	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Position	Ihs Manufacturer	Package Description	Reach Compliance Code	Pin Count	ECCN Code	HTS Code	Samacsys Manufacturer

$7.6381

Active

300 mA

4 ns

SILICON

RECTIFIER DIODE

SINGLE

YES

METALLURGICALLY BONDED

Qualified

O-XELF-R2

MIL-19500/609D

ISOLATED

UNSPECIFIED

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

SURFACE MOUNT PACKAGE-2

compliant

$8.4016

Transferred

300 mA

1 V

4 ns

100 nA

SILICON

RECTIFIER DIODE

SINGLE

YES

2.5 A

Not Qualified

O-LELF-R2

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROSEMI CORP

HERMETIC SEALED, GLASS, D-5D, 2 PIN

unknown

EAR99

8541.10.00.70

Microsemi Corporation

$8.7543

Active

300 mA

1 V

4 ns

100 nA

SILICON

RECTIFIER DIODE

SINGLE

YES

METALLURGICALLY BONDED

2.5 A

Qualified

O-XELF-R2

MIL-19500/609D

175 °C

-65 °C

235

ISOLATED

UNSPECIFIED

ROUND

LONG FORM

Tin/Lead (Sn/Pb)

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

SURFACE MOUNT PACKAGE-2

compliant

Microchip

$8.8243

Active

300 mA

1 V

4 ns

100 nA

SILICON

75 V

RECTIFIER DIODE

SINGLE

YES

50 V

GENERAL PURPOSE

2.5 A

50 V

O-LELF-R2

MIL-PRF-19500

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

compliant

EAR99

8541.21.00.40

$9.6442

Active

300 mA

1 V

4 ns

100 nA

SILICON

RECTIFIER DIODE

SINGLE

YES

2.5 A

Not Qualified

O-LELF-R2

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED, GLASS, D-5D, 2 PIN

compliant

Microchip

$10.0426

Transferred

300 mA

4 ns

SILICON

RECTIFIER DIODE

SINGLE

YES

50 V

METALLURGICALLY BONDED

Not Qualified

O-LELF-R2

MIL-19500/578

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

AEROFLEX/METELICS INC

HERMETIC SEALED GLASS PACKAGE-2

unknown

EAR99

8541.10.00.70

$11.9060

Transferred

300 mA

4 ns

SILICON

RECTIFIER DIODE

SINGLE

YES

50 V

METALLURGICALLY BONDED

Qualified

O-LELF-R2

MIL-19500/578

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

M/A-COM TECHNOLOGY SOLUTIONS INC

HERMETIC SEALED GLASS PACKAGE-2

compliant

EAR99

8541.10.00.70

$13.0314

Active

RECTIFIER DIODE

MICROCHIP TECHNOLOGY INC

unknown

EAR99

$14.4769

Active

300 mA

1 V

4 ns

100 nA

SILICON

RECTIFIER DIODE

SINGLE

YES

50 V

METALLURGICALLY BONDED

2.5 A

Qualified

O-XELF-R2

MIL-19500/609D

175 °C

-65 °C

ISOLATED

UNSPECIFIED

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

SURFACE MOUNT PACKAGE-2

compliant

$14.4977

Active

300 mA

1 V

4 ns

100 nA

SILICON

RECTIFIER DIODE

SINGLE

YES

50 V

METALLURGICALLY BONDED

2.5 A

Qualified

O-XELF-R2

MIL-19500/609D

175 °C

-65 °C

ISOLATED

UNSPECIFIED

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

unknown

EAR99

8541.21.00.40

1 2 3 4 5 Next

Compare

JAN1N6640US

Microchip Technology Inc

$7.6381

Active

300 mA

4 ns

SILICON

RECTIFIER DIODE

SINGLE

YES

METALLURGICALLY BONDED

Qualified

O-XELF-R2

MIL-19500/609D

ISOLATED

UNSPECIFIED

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

SURFACE MOUNT PACKAGE-2

compliant

1N6640US

Microsemi Corporation

$8.4016

Transferred

300 mA

1 V

4 ns

100 nA

SILICON

RECTIFIER DIODE

SINGLE

YES

2.5 A

Not Qualified

O-LELF-R2

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROSEMI CORP

HERMETIC SEALED, GLASS, D-5D, 2 PIN

unknown

EAR99

8541.10.00.70

Microsemi Corporation

JANTX1N6640US

Microchip Technology Inc

$8.7543

Active

300 mA

1 V

4 ns

100 nA

SILICON

RECTIFIER DIODE

SINGLE

YES

METALLURGICALLY BONDED

2.5 A

Qualified

O-XELF-R2

MIL-19500/609D

175 °C

-65 °C

235

ISOLATED

UNSPECIFIED

ROUND

LONG FORM

Tin/Lead (Sn/Pb)

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

SURFACE MOUNT PACKAGE-2

compliant

Microchip

JANTX1N6640US/TR

Microchip Technology Inc

$8.8243

Active

300 mA

1 V

4 ns

100 nA

SILICON

75 V

RECTIFIER DIODE

SINGLE

YES

50 V

GENERAL PURPOSE

2.5 A

50 V

O-LELF-R2

MIL-PRF-19500

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

compliant

EAR99

8541.21.00.40

1N6640US

Microchip Technology Inc

$9.6442

Active

300 mA

1 V

4 ns

100 nA

SILICON

RECTIFIER DIODE

SINGLE

YES

2.5 A

Not Qualified

O-LELF-R2

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED, GLASS, D-5D, 2 PIN

compliant

Microchip

JANTX1N6640US

Cobham Semiconductor Solutions

$10.0426

Transferred

300 mA

4 ns

SILICON

RECTIFIER DIODE

SINGLE

YES

50 V

METALLURGICALLY BONDED

Not Qualified

O-LELF-R2

MIL-19500/578

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

AEROFLEX/METELICS INC

HERMETIC SEALED GLASS PACKAGE-2

unknown

EAR99

8541.10.00.70

JANTX1N6640US

MACOM

$11.9060

Transferred

300 mA

4 ns

SILICON

RECTIFIER DIODE

SINGLE

YES

50 V

METALLURGICALLY BONDED

Qualified

O-LELF-R2

MIL-19500/578

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

M/A-COM TECHNOLOGY SOLUTIONS INC

HERMETIC SEALED GLASS PACKAGE-2

compliant

EAR99

8541.10.00.70

MNS1N6640US/TR

Microchip Technology Inc

$13.0314

Active

RECTIFIER DIODE

MICROCHIP TECHNOLOGY INC

unknown

EAR99

JANTXV1N6640US

Microchip Technology Inc

$14.4769

Active

300 mA

1 V

4 ns

100 nA

SILICON

RECTIFIER DIODE

SINGLE

YES

50 V

METALLURGICALLY BONDED

2.5 A

Qualified

O-XELF-R2

MIL-19500/609D

175 °C

-65 °C

ISOLATED

UNSPECIFIED

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

SURFACE MOUNT PACKAGE-2

compliant

JANTXV1N6640US/TR

Microchip Technology Inc

$14.4977

Active

300 mA

1 V

4 ns

100 nA

SILICON

RECTIFIER DIODE

SINGLE

YES

50 V

METALLURGICALLY BONDED

2.5 A

Qualified

O-XELF-R2

MIL-19500/609D

175 °C

-65 °C

ISOLATED

UNSPECIFIED

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

unknown

EAR99

8541.21.00.40

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