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1N821A
American Power Devices Inc
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$1.8859 | Obsolete | 7.5 mA | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | 10 Ω | 0.62 mV/°C | 4.83 % | Not Qualified | O-LALF-W2 | e3 | DO-7 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN | WIRE | AXIAL | AMERICAN POWER DEVICES INC | DO-7 | HERMETIC SEALED, GLASS PACKAGE-2 | 2 | unknown | EAR99 | 8541.10.00.50 | ||||||||||
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1N821A-1
Microchip Technology Inc
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$3.8729 | No | Active | 7.5 mA | 2 µA | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 10 Ω | 3 V | 0.62 mV/°C | 5 % | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | |||||||||
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1N821A-1/TR
Microchip Technology Inc
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$4.0387 | No | Active | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.62 mV/°C | 4.84 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant | EAR99 | 8541.10.00.50 | ||||||||||||
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1N821A
Microchip Technology Inc
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$4.0700 | No | Active | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.62 mV/°C | 4.84 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant | |||||||||||||
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1N821A-1E3
Microchip Technology Inc
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$4.0765 | Yes | Active | 7.5 mA | 2 µA | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 10 Ω | 3 V | 0.62 mV/°C | 5 % | O-LALF-W2 | e3 | MIL-19500 | DO-204AH | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | |||||||||
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1N821A/TR
Microchip Technology Inc
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$4.1971 | Active | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.62 mV/°C | 4.84 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | |||||||||||||
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1N821AUR-1
Microchip Technology Inc
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$4.3608 | No | Active | 7.5 mA | 2 µA | 500 mW | 6.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICAL BONDED | 10 Ω | 3 V | 0.62 mV/°C | 5 % | O-LELF-R2 | e0 | DO-213AA | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | MELF-2 | compliant | |||||||||
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1N821AUR
Microchip Technology Inc
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$4.3608 | No | Active | 7.5 mA | 500 mW | 6.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 10 Ω | 0.62 mV/°C | 4.84 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||||
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1N821AUR-1/TR
Microchip Technology Inc
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$4.5164 | No | Active | 7.5 mA | 500 mW | 6.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | TR, 7 INCH; 2000 | 10 Ω | 0.62 mV/°C | 4.84 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | EAR99 | 8541.10.00.50 | |||||||||
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1N821AE3
Microchip Technology Inc
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$4.5429 | Yes | Active | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.62 mV/°C | 4.84 % | O-LALF-W2 | e3 | DO-204AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant |