Findchips: Parametric Search Results for 1n825a-1e3


Select Parts		Part Number

		1N825A-1E3 Microchip Technology Inc
		1N825A-1E3 Microsemi Corporation
		1N825A-1E3/TR Microchip Technology Inc
		1N825A-1E3TR Microsemi Corporation

				Most Relevant										Technical					Compliance				Operating Conditions		Physical								Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Working Test Current	Reverse Current-Max	Power Dissipation-Max	Reference Voltage-Nom	Diode Element Material	Diode Type	Configuration	Surface Mount	Number of Elements	Technology	Additional Feature	Dynamic Impedance-Max	Reverse Test Voltage	Voltage Temp Coeff-Max	Voltage Tol-Max	JESD-30 Code	JESD-609 Code	Reference Standard	JEDEC-95 Code	Operating Temperature-Max	Operating Temperature-Min	Case Connection	Number of Terminals	Package Body Material	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Position	Ihs Manufacturer	Package Description	Reach Compliance Code	Samacsys Manufacturer	Part Package Code	Pin Count	ECCN Code	HTS Code

$4.8371

Yes

Active

7.5 mA

2 µA

500 mW

6.2 V

SILICON

ZENER DIODE

SINGLE

ZENER

METALLURGICALLY BONDED

10 Ω

3 V

0.124 mV/°C

5 %

O-LALF-W2

MIL-19500

DO-204AH

175 °C

-55 °C

ISOLATED

GLASS

ROUND

LONG FORM

MATTE TIN

WIRE

AXIAL

MICROCHIP TECHNOLOGY INC

DO-35, 2 PIN

compliant

Microchip

$4.8563

Yes

Transferred

7.5 mA

2 µA

500 mW

6.2 V

SILICON

ZENER DIODE

SINGLE

ZENER

METALLURGICALLY BONDED

10 Ω

3 V

0.124 mV/°C

5 %

O-LALF-W2

MIL-19500

DO-204AH

175 °C

-55 °C

ISOLATED

GLASS

ROUND

LONG FORM

MATTE TIN

WIRE

AXIAL

MICROSEMI CORP

DO-35, 2 PIN

compliant

Microsemi Corporation

DO-35

EAR99

8541.10.00.50

$5.0241

Yes

Active

500 mW

6.2 V

SILICON

ZENER DIODE

SINGLE

ZENER

METALLURGICALLY BONDED

0.124 mV/°C

4.84 %

O-LALF-W2

DO-204AA

ISOLATED

GLASS

ROUND

LONG FORM

TIN

WIRE

AXIAL

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED, GLASS, DO-7, 2 PIN

compliant

Microchip

EAR99

8541.10.00.50

Check for Price

Yes

Transferred

500 mW

6.2 V

SILICON

ZENER DIODE

SINGLE

ZENER

METALLURGICALLY BONDED

0.124 mV/°C

4.84 %

O-LALF-W2

DO-204AA

ISOLATED

GLASS

ROUND

LONG FORM

TIN

WIRE

AXIAL

MICROSEMI CORP

O-LALF-W2

not_compliant

EAR99

8541.10.00.50

Compare

1N825A-1E3

Microchip Technology Inc

$4.8371

Yes

Active

7.5 mA

2 µA

500 mW

6.2 V

SILICON

ZENER DIODE

SINGLE

ZENER

METALLURGICALLY BONDED

10 Ω

3 V

0.124 mV/°C

5 %

O-LALF-W2

MIL-19500

DO-204AH

175 °C

-55 °C

ISOLATED

GLASS

ROUND

LONG FORM

MATTE TIN

WIRE

AXIAL

MICROCHIP TECHNOLOGY INC

DO-35, 2 PIN

compliant

Microchip

1N825A-1E3

Microsemi Corporation

$4.8563

Yes

Transferred

7.5 mA

2 µA

500 mW

6.2 V

SILICON

ZENER DIODE

SINGLE

ZENER

METALLURGICALLY BONDED

10 Ω

3 V

0.124 mV/°C

5 %

O-LALF-W2

MIL-19500

DO-204AH

175 °C

-55 °C

ISOLATED

GLASS

ROUND

LONG FORM

MATTE TIN

WIRE

AXIAL

MICROSEMI CORP

DO-35, 2 PIN

compliant

Microsemi Corporation

DO-35

EAR99

8541.10.00.50

1N825A-1E3/TR

Microchip Technology Inc

$5.0241

Yes

Active

500 mW

6.2 V

SILICON

ZENER DIODE

SINGLE

ZENER

METALLURGICALLY BONDED

0.124 mV/°C

4.84 %

O-LALF-W2

DO-204AA

ISOLATED

GLASS

ROUND

LONG FORM

TIN

WIRE

AXIAL

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED, GLASS, DO-7, 2 PIN

compliant

Microchip

EAR99

8541.10.00.50

1N825A-1E3TR

Microsemi Corporation

Check for Price

Yes

Transferred

500 mW

6.2 V

SILICON

ZENER DIODE

SINGLE

ZENER

METALLURGICALLY BONDED

0.124 mV/°C

4.84 %

O-LALF-W2

DO-204AA

ISOLATED

GLASS

ROUND

LONG FORM

TIN

WIRE

AXIAL

MICROSEMI CORP

O-LALF-W2

not_compliant

EAR99

8541.10.00.50

Parametric results for: 1n825a-1e3 under Zener Diodes