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1 - 10 of 186 results
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1N944A
Microchip Technology Inc
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$23.2762 | No | Active | 500 mW | 11.7 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.117 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7 | compliant | ||||||||||||||
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1N944A-1E3
Microchip Technology Inc
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$23.4776 | Yes | Active | 7.5 mA | 500 mW | 11.7 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.117 mV/°C | 5 % | O-LALF-W2 | e3 | DO-204AH | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | ROHS COMPLIANT, HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | |||||||||||
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1N944B
Microchip Technology Inc
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$25.2179 | No | Active | 500 mW | 11.7 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.117 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7 | compliant | ||||||||||||
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1N944BE3
Microchip Technology Inc
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$25.6094 | Yes | Active | 500 mW | 11.7 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.117 mV/°C | 5 % | O-LALF-W2 | DO-204AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7 | compliant | |||||||||||||||||
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1N944
Microchip Technology Inc
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$34.1229 | No | Active | 500 mW | 11.7 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.117 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7 | compliant | |||||||||||
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1N944/TR
Microchip Technology Inc
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$34.3343 | Active | 500 mW | 11.7 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.117 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | |||||||||||
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1N944B
American Power Devices Inc
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Check for Price | Obsolete | 7.5 mA | 500 mW | 11.7 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 30 Ω | 0.117 mV/°C | 4.95 % | Not Qualified | O-LALF-W2 | e3 | DO-7 | 150 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN | WIRE | AXIAL | AMERICAN POWER DEVICES INC | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | EAR99 | 8541.10.00.50 | DO-7 | 2 | ||||||||
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1N944
Motorola Mobility LLC
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Check for Price | No | Obsolete | 7.5 mA | 500 mW | 11.7 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | 30 Ω | 0.117 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MOTOROLA INC | O-LALF-W2 | unknown | EAR99 | 8541.10.00.50 | |||||||||
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1N944B
Invensys Sensor Systems
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Check for Price | No | Transferred | 7.5 mA | 500 mW | 11.7 V | ZENER DIODE | SINGLE | NO | 1 | 30 Ω | 5 % | e0 | 150 °C | Tin/Lead (Sn/Pb) | INVENSYS SENSOR SYSTEMS | unknown | EAR99 | 8541.10.00.50 | ||||||||||||||||||||||||
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1N944B
Freescale Semiconductor
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Check for Price | No | Obsolete | 7.5 mA | 500 mW | 11.7 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | 30 Ω | 0.117 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 150 °C | -55 °C | NOT SPECIFIED | NOT SPECIFIED | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MOTOROLA SEMICONDUCTOR PRODUCTS | O-LALF-W2 | unknown |