Parametric results for: 24LC04B I-P under EEPROMs
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24LC04BT-I/SN
Microchip Technology Inc
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$0.2466 | Yes | Yes | Active | 4.096 kbit | 8 | 512X8 | 5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010XXMR | 1 | 1 | 512 | 512 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 5 V | I2C | 1 µA | 3 µA | 5.5 V | 2.5 V | CMOS | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | AEC-Q100 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOIC | 8 | compliant | EAR99 | 8542.32.00.51 | 1991-01-01 | Microchip | ||||||
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24LC04B-I/SN
Microchip Technology Inc
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$0.2775 | Yes | Yes | Active | 4.096 kbit | 8 | 512X8 | 5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010XXMR | 1 | 1 | 512 | 512 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 5 V | I2C | 1 µA | 3 µA | 5.5 V | 2.5 V | CMOS | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | AEC-Q100 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOIC | 8 | compliant | EAR99 | 8542.32.00.51 | 1991-01-01 | Microchip | ||||||
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24LC04B/SN
Microchip Technology Inc
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$0.2856 | Yes | Yes | Active | 4.096 kbit | 8 | 512X8 | 5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010XXMR | 1 | 1 | 512 | 512 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 5 V | I2C | 100 µA | 3 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOIC | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | 0.150 INCH, PLASTIC, SOIC-8 | |||||||
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24LC04BT-I/OT
Microchip Technology Inc
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$0.2870 | Yes | Yes | Active | 4.096 kbit | 8 | 512X8 | 5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010XXMR | 1 | 1 | 512 | 512 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 5 V | I2C | 1 µA | 3 µA | 5.5 V | 2.5 V | CMOS | 5 ms | HARDWARE | R-PDSO-G5 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | AEC-Q100 | 5 | PLASTIC/EPOXY | LSSOP | TSOP5,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.45 mm | 2.9 mm | 1.6 mm | MICROCHIP TECHNOLOGY INC | SOT-23 | 5 | compliant | EAR99 | 8542.32.00.51 | 1991-01-01 | Microchip | SOT-23, 5 PIN | ||||||
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24LC04BH-I/SN
Microchip Technology Inc
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$0.3442 | Yes | Active | 4.096 kbit | 8 | 512X8 | 5 V | 400 kHz | EEPROM | YES | 200 | 1000000 Write/Erase Cycles | 1010XXMR | 1 | 1 | 512 | 512 words | SYNCHRONOUS | OPEN-DRAIN | 16 words | SERIAL | 5 V | I2C | 5 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOIC | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | SOIC-8 | |||||
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24LC04BHT-I/SN
Microchip Technology Inc
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$0.3470 | Yes | Active | 4.096 kbit | 8 | 512X8 | 5 V | 400 kHz | EEPROM | YES | 200 | 1000000 Write/Erase Cycles | 1010XXMR | 1 | 1 | 512 | 512 words | SYNCHRONOUS | OPEN-DRAIN | 16 words | SERIAL | 5 V | I2C | 5 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOIC | 8 | compliant | EAR99 | 8542.32.00.51 | SOIC-8 | ||||||
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24LC04BH-I/MS
Microchip Technology Inc
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$0.3757 | Yes | Active | 4.096 kbit | 8 | 512X8 | 5 V | 400 kHz | EEPROM | YES | 200 | 1000000 Write/Erase Cycles | 1010XXMR | 1 | 1 | 512 | 512 words | SYNCHRONOUS | OPEN-DRAIN | 16 words | SERIAL | 5 V | I2C | 5 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | S-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.19 | SQUARE | SMALL OUTLINE | YES | Matte Tin (Sn) - annealed | GULL WING | 650 µm | DUAL | 1.1 mm | 3 mm | 3 mm | MICROCHIP TECHNOLOGY INC | MSOP | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | MSOP-8 | |||||
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24LC04BH-I/ST
Microchip Technology Inc
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$0.3841 | Yes | Active | 4.096 kbit | 8 | 512X8 | 5 V | 400 kHz | EEPROM | YES | 200 | 1000000 Write/Erase Cycles | 1010XXMR | 1 | 1 | 512 | 512 words | SYNCHRONOUS | OPEN-DRAIN | 16 words | SERIAL | 5 V | I2C | 5 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) - annealed | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | MICROCHIP TECHNOLOGY INC | SOIC | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | TSSOP-8 | |||||
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24LC04B-I/ST
Microchip Technology Inc
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$0.3932 | Yes | Yes | Active | 4.096 kbit | 8 | 512X8 | 5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010XXMR | 1 | 1 | 512 | 512 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 5 V | I2C | 1 µA | 3 µA | 5.5 V | 2.5 V | CMOS | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | AEC-Q100 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | MICROCHIP TECHNOLOGY INC | SOIC | 8 | compliant | EAR99 | 8542.32.00.51 | 1991-01-01 | Microchip | TSSOP-8 | |||||
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24LC04BT-I/MS
Microchip Technology Inc
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$0.4298 | Yes | Yes | Active | 4.096 kbit | 8 | 512X8 | 5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010XXMR | 1 | 1 | 512 | 512 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 5 V | I2C | 1 µA | 3 µA | 5.5 V | 2.5 V | CMOS | 5 ms | HARDWARE | S-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | AEC-Q100 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 1.1 mm | 3 mm | 3 mm | MICROCHIP TECHNOLOGY INC | MSOP | 8 | compliant | EAR99 | 8542.32.00.51 | 1991-01-01 | Microchip | MSOP-8 |