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AT24C02C-PUM
Atmel Corporation
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$0.1383 | Yes | Transferred | 2.048 kbit | 8 | 256X8 | 2.5 V | 1 MHz | EEPROM | 100 YEAR DATA RETENTION | 100 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 256 | 256 words | SYNCHRONOUS | SERIAL | I2C | 1 µA | 3 µA | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDIP-T8 | Not Qualified | e3 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | Matte Tin (Sn) | THROUGH-HOLE | 2.54 mm | DUAL | 5.334 mm | 9.271 mm | 7.62 mm | ATMEL CORP | DIP | 0.300 INCH, GREEN, PLASTIC, MS-001BA, DIP-8 | 8 | unknown | EAR99 | 8542.32.00.51 | Microchip | |||||||||||
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AT24C02C-MAHM-T
Microchip Technology Inc
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$0.1980 | Yes | Yes | Active | 2.048 kbit | 8 | 256X8 | 2.5 V | 1 MHz | EEPROM | 100 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 256 | 256 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 2.5 V | I2C | 6 µA | 3 µA | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-N8 | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.12,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 600 µm | 3 mm | 2 mm | MICROCHIP TECHNOLOGY INC | UDFN-8 | compliant | EAR99 | 8542.32.00.51 | Microchip | 2016-12-07 | |||||||
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AT24C02C-SSHM-B
Atmel Corporation
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$0.2021 | Yes | Transferred | 2.048 kbit | 8 | 256X8 | 2.5 V | 1 MHz | EEPROM | 100 YEAR DATA RETENTION | 100 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 256 | 256 words | SYNCHRONOUS | SERIAL | I2C | 1 µA | 3 µA | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.925 mm | 3.9 mm | ATMEL CORP | SOIC | SOP, SOP8,.25 | 8 | unknown | EAR99 | 8542.32.00.51 | Microchip | |||||||||||
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AT24C02C-STUM-T
Microchip Technology Inc
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$0.2137 | Yes | Yes | Active | 2.048 kbit | 8 | 256X8 | 2.5 V | 1 MHz | EEPROM | 100 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 256 | 256 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 2.5 V | I2C | 6 µA | 3 µA | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G5 | e3 | 1 | 85 °C | -40 °C | 260 | 40 | 5 | PLASTIC/EPOXY | VSSOP | TSOP5/6,.11,37 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1 mm | 2.9 mm | 1.6 mm | MICROCHIP TECHNOLOGY INC | SOT-23, 5 PIN | compliant | EAR99 | 8542.32.00.51 | Microchip | 2016-12-07 | |||||||
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AT24C02C-MAHM-E
Microchip Technology Inc
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$0.2487 | Yes | Active | 2.048 kbit | 8 | 256X8 | 2.5 V | 1 MHz | EEPROM | 100 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 256 | 256 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 2.5 V | I2C | 6 µA | 3 µA | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-N8 | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.12,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 600 µm | 3 mm | 2 mm | MICROCHIP TECHNOLOGY INC | UDFN-8 | compliant | EAR99 | 8542.32.00.51 | Microchip | 2016-12-07 | ||||||||
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AT24C02C-SSHM-B
Microchip Technology Inc
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$0.2703 | Yes | Yes | Active | 2.048 kbit | 8 | 256X8 | 2.5 V | 1 MHz | EEPROM | 100 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 256 | 256 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 2.5 V | I2C | 6 µA | 3 µA | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | e3 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.925 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOIC-8 | compliant | EAR99 | 8542.32.00.51 | Microchip | 2016-12-07 | |||||||
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AT24C02C-SSHM-T
Microchip Technology Inc
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$0.2716 | Yes | Yes | Active | 2.048 kbit | 8 | 256X8 | 2.5 V | 1 MHz | EEPROM | 100 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 256 | 256 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 2.5 V | I2C | 6 µA | 3 µA | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | e3 | 1 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.925 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOIC-8 | compliant | EAR99 | 8542.32.00.51 | Microchip | 2016-12-07 | |||||||||
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AT24C02C-XHM-B
Microchip Technology Inc
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$0.2784 | Yes | Yes | Active | 2.048 kbit | 8 | 256X8 | 2.5 V | 1 MHz | EEPROM | 100 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 256 | 256 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 2.5 V | I2C | 6 µA | 3 µA | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | MICROCHIP TECHNOLOGY INC | TSSOP-8 | compliant | EAR99 | 8542.32.00.51 | Microchip | 2016-12-07 | |||||||
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AT24C02C-XHM-T
Microchip Technology Inc
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$0.2892 | Yes | Yes | Active | 2.048 kbit | 8 | 256X8 | 2.5 V | 1 MHz | EEPROM | 100 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 256 | 256 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 2.5 V | I2C | 6 µA | 3 µA | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | MICROCHIP TECHNOLOGY INC | TSSOP-8 | compliant | EAR99 | 8542.32.00.51 | Microchip | 2016-12-07 | |||||||
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24C02CT-I/MNY
Microchip Technology Inc
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$0.2998 | Yes | Yes | Active | 2.048 kbit | 8 | 256X8 | 5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 256 | 256 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 5 V | I2C | 5 µA | 3 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | 1 ms | HARDWARE | R-PDSO-N8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | DUAL | 800 µm | 3 mm | 2 mm | MICROCHIP TECHNOLOGY INC | DFN | 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip |