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Parametric results for: 256-kword under EEPROMs

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287 hits
287 hits
Manufacturer Part Number: 256k
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5962-9315502HYX
 Mercury Systems Inc 		Check for Price No Active 125 °C -55 °C 40.6 mm MERCURY SYSTEMS INC HERMETIC SEALED, BOTTOM BRAZED, CERAMIC, DIP-32 compliant 3A001.A.2.C 8542.32.00.51 150 ns R-CDIP-T32 e4 2.0972 Mbit EEPROM MODULE 8 1 32 262.144 k 256000 ASYNCHRONOUS 256KX8 CERAMIC, METAL-SEALED COFIRED DIP RECTANGULAR IN-LINE PARALLEL 5 V Not Qualified MIL-PRF-38534 Class H 5.1 mm 5.5 V 4.5 V 5 V NO CMOS MILITARY GOLD THROUGH-HOLE 2.54 mm DUAL 15.24 mm 10 ms
5962-9315701HXA
 Microsemi Corporation 		Check for Price Transferred 125 °C -55 °C MICROSEMI CORP DIP, compliant 3A001.A.2.C 8542.32.00.41 120 ns R-CDIP-T32 e0 2.0972 Mbit SRAM MODULE 8 1 32 262.144 k 256000 ASYNCHRONOUS 256KX8 CERAMIC, METAL-SEALED COFIRED DIP RECTANGULAR IN-LINE PARALLEL Not Qualified 5.5 V 4.5 V 5 V NO CMOS MILITARY TIN LEAD THROUGH-HOLE DUAL
5962-9315702HYC
 White Electronic Designs Corp 		Check for Price Transferred 125 °C -55 °C 41.525 mm WHITE ELECTRONIC DESIGNS CORP DIP-32 unknown 3A001.A.2.C 8542.32.00.41 100 ns R-XDIP-T32 e4 2.0972 Mbit SRAM MODULE 8 1 32 262.144 k 256000 ASYNCHRONOUS 256KX8 UNSPECIFIED DIP RECTANGULAR IN-LINE PARALLEL Not Qualified MIL-STD-883 5.13 mm 5.5 V 4.5 V 5 V NO CMOS MILITARY GOLD THROUGH-HOLE 2.54 mm DUAL 15.24 mm COMMON 3-STATE DIP32,.6 1 mA 2 V 70 µA
5962-9690201HNC
 Microsemi Corporation 		Check for Price Obsolete 125 °C -55 °C 28.445 mm MICROSEMI CORP DFP, unknown 3A001.A.2.C 8542.32.00.41 35 ns R-CQFP-F44 e4 4.1943 Mbit STANDARD SRAM 16 1 44 262.144 k 256000 ASYNCHRONOUS 256KX16 CERAMIC, METAL-SEALED COFIRED DFP RECTANGULAR FLATPACK PARALLEL Not Qualified MIL-STD-883 3.18 mm 5.5 V 4.5 V 5 V YES CMOS MILITARY GOLD FLAT 1.27 mm QUAD 12.955 mm QFP 44
5962-9315704HXA
 White Electronic Designs Corp 		Check for Price Obsolete 125 °C -55 °C WHITE ELECTRONIC DESIGNS CORP unknown 3A001.A.2.C 8542.32.00.41 70 ns R-CDIP-T32 e0 2.0972 Mbit MULTI-PORT SRAM MODULE 8 1 32 262.144 k 256000 ASYNCHRONOUS 256KX8 CERAMIC, METAL-SEALED COFIRED DIP RECTANGULAR IN-LINE PARALLEL Not Qualified 38535Q/M;38534H;883B 5.5 V 4.5 V 5 V NO CMOS MILITARY TIN LEAD THROUGH-HOLE 2.54 mm DUAL COMMON 3-STATE DIP32,.6 2 mA 2 V 90 µA
5962-9690204HNC
 White Microelectronics 		Check for Price Obsolete 125 °C -55 °C 28.445 mm WHITE MICROELECTRONICS CERAMIC, QFP-44 unknown 3A001.A.2.C 8542.32.00.41 17 ns R-CQFP-F44 e4 4.1943 Mbit STANDARD SRAM 16 1 44 262.144 k 256000 ASYNCHRONOUS 256KX16 CERAMIC, METAL-SEALED COFIRED DFP RECTANGULAR FLATPACK PARALLEL Not Qualified 3.18 mm 5.5 V 4.5 V 5 V YES CMOS MILITARY GOLD FLAT 1.27 mm QUAD 12.955 mm
5962-9315502HXC
 White Microelectronics 		Check for Price Transferred AUTOMATIC WRITE 125 °C -55 °C 42.4 mm WHITE MICROELECTRONICS DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 unknown 150 ns R-CDIP-T32 e4 2.0972 Mbit EEPROM MODULE 8 1 32 262.144 k 256000 ASYNCHRONOUS 256KX8 CERAMIC, METAL-SEALED COFIRED DIP RECTANGULAR IN-LINE PARALLEL 5 V Not Qualified 6.98 mm 5.5 V 4.5 V 5 V NO CMOS MILITARY GOLD THROUGH-HOLE 2.54 mm DUAL 15.24 mm 3-STATE
5962-9690203HNC
 White Microelectronics 		Check for Price Obsolete 125 °C -55 °C 28.445 mm WHITE MICROELECTRONICS CERAMIC, QFP-44 unknown 3A001.A.2.C 8542.32.00.41 20 ns R-CQFP-F44 e4 4.1943 Mbit STANDARD SRAM 16 1 44 262.144 k 256000 ASYNCHRONOUS 256KX16 CERAMIC, METAL-SEALED COFIRED DFP RECTANGULAR FLATPACK PARALLEL Not Qualified 3.18 mm 5.5 V 4.5 V 5 V YES CMOS MILITARY GOLD FLAT 1.27 mm QUAD 12.955 mm
5962-9315704HYA
 Microsemi Corporation 		Check for Price Transferred 125 °C -55 °C 41.525 mm MICROSEMI CORP DIP, compliant 3A001.A.2.C 8542.32.00.41 70 ns R-XDIP-T32 e0 2.0972 Mbit SRAM MODULE 8 1 32 262.144 k 256000 ASYNCHRONOUS 256KX8 UNSPECIFIED DIP RECTANGULAR IN-LINE PARALLEL Not Qualified MIL-STD-883 5.13 mm 5.5 V 4.5 V 5 V NO CMOS MILITARY TIN LEAD THROUGH-HOLE 2.54 mm DUAL 15.24 mm DIP 32
5962-9315708HXX
 White Electronic Designs Corp 		Check for Price Obsolete BATTERY BACK-UP OPERATION 125 °C -55 °C 42.4 mm WHITE ELECTRONIC DESIGNS CORP 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 unknown 3A001.A.2.C 8542.32.00.41 25 ns R-CDIP-T32 2.0972 Mbit SRAM MODULE 8 1 32 262.144 k 256000 ASYNCHRONOUS 256KX8 CERAMIC, METAL-SEALED COFIRED DIP RECTANGULAR IN-LINE PARALLEL Not Qualified 5.1 mm 5.5 V 4.5 V 5 V NO CMOS MILITARY THROUGH-HOLE 2.54 mm DUAL 15.24 mm
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