Findchips: Parametric Search Results for 27C1001â

Parametric results for: 27C1001â under EPROMs

Select parts from the table below to compare.

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Select Parts		Part Number

		M27C1001-12F1 STMicroelectronics
		M27C1001-10L1LTR STMicroelectronics
		MBM27C1001-25Z FUJITSU Semiconductor Limited
		M27C1001-20XL1X STMicroelectronics
		M27C1001-80XL1LTR STMicroelectronics
		27C1001MEQ20 Thales Group
		27C1001MEQ20 Thomson-CSF Compsants Specific
		M27C1001-90XL1XTR STMicroelectronics
		M27C1001-45XF3 STMicroelectronics
		AM27C100-125DC AMD

				Most Relevant					Technical														Compliance			Operating Conditions			Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

$3.3856

Yes

Obsolete

1.0486 Mbit

128KX8

5 V

120 ns

UVPROM

COMMON

128000

131.072 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-CDIP-T32

Not Qualified

70 °C

245

CERAMIC, METAL-SEALED COFIRED

WDIP

DIP32,.6

RECTANGULAR

IN-LINE, WINDOW

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

5.72 mm

41.885 mm

15.24 mm

STMICROELECTRONICS

DIP

LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32

unknown

EAR99

8542.32.00.61

STMicroelectronics

Check for Price

Obsolete

1.0486 Mbit

128KX8

5 V

100 ns

UVPROM

COMMON

128000

131.072 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

CMOS

COMMERCIAL

R-XQCC-N32

Not Qualified

70 °C

CERAMIC

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

STMICROELECTRONICS

not_compliant

EAR99

8542.32.00.61

Check for Price

Obsolete

1.0486 Mbit

128KX8

5 V

250 ns

UVPROM

128000

131.072 k

ASYNCHRONOUS

PARALLEL

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-GDIP-T32

Not Qualified

70 °C

CERAMIC, GLASS-SEALED

WDIP

RECTANGULAR

IN-LINE, WINDOW

THROUGH-HOLE

2.54 mm

DUAL

5.84 mm

41.91 mm

15.24 mm

FUJITSU SEMICONDUCTOR AMERICA INC

WDIP,

unknown

EAR99

8542.32.00.61

Check for Price

Yes

Obsolete

1.0486 Mbit

128KX8

5 V

120 ns

UVPROM

COMMON

128000

131.072 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-CQCC-N32

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER, WINDOW

YES

GOLD

NO LEAD

1.27 mm

QUAD

2.28 mm

13.97 mm

11.43 mm

STMICROELECTRONICS

QFJ

CERAMIC, LCC-32

compliant

EAR99

8542.32.00.61

Check for Price

Obsolete

1.0486 Mbit

128KX8

5 V

80 ns

UVPROM

COMMON

128000

131.072 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

CMOS

COMMERCIAL

R-XQCC-N32

Not Qualified

70 °C

CERAMIC

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

STMICROELECTRONICS

not_compliant

EAR99

8542.32.00.61

Check for Price

Transferred

1.0486 Mbit

128KX8

5 V

200 ns

UVPROM

128000

131.072 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-CQCC-N32

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

RECTANGULAR

CHIP CARRIER

YES

NO LEAD

QUAD

THOMSON-CSF SEMICONDUCTORS

QFJ

unknown

3A001.A.2.C

8542.32.00.61

Check for Price

Obsolete

THOMSON-CSF COMPSANTS SPECIFIC

unknown

EAR99

8542.32.00.71

Check for Price

Obsolete

1.0486 Mbit

128KX8

5 V

90 ns

UVPROM

COMMON

128000

131.072 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

CMOS

COMMERCIAL

R-XQCC-N32

70 °C

CERAMIC

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

STMICROELECTRONICS

not_compliant

EAR99

8542.32.00.61

Check for Price

Yes

Obsolete

1.0486 Mbit

128KX8

5 V

45 ns

UVPROM

COMMON

128000

131.072 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

5.25 V

4.75 V

CMOS

AUTOMOTIVE

R-CDIP-T32

Not Qualified

125 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

WDIP

DIP32,.6

RECTANGULAR

IN-LINE, WINDOW

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

5.72 mm

41.885 mm

15.24 mm

STMICROELECTRONICS

DIP

LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32

compliant

EAR99

8542.32.00.61

Check for Price

Obsolete

1.0486 Mbit

128KX8

5 V

120 ns

UVPROM

COMMON

128000

131.072 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-GDIP-T32

Not Qualified

70 °C

CERAMIC, GLASS-SEALED

WDIP

DIP32,.6

RECTANGULAR

IN-LINE, WINDOW

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.588 mm

42.1005 mm

15.24 mm

ADVANCED MICRO DEVICES INC

DIP

WDIP, DIP32,.6

unknown

EAR99

8542.32.00.61

1 2 3 4 5 Next

Compare

M27C1001-12F1

STMicroelectronics

$3.3856

Yes

Obsolete

1.0486 Mbit

128KX8

5 V

120 ns

UVPROM

COMMON

128000

131.072 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-CDIP-T32

Not Qualified

70 °C

245

CERAMIC, METAL-SEALED COFIRED

WDIP

DIP32,.6

RECTANGULAR

IN-LINE, WINDOW

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

5.72 mm

41.885 mm

15.24 mm

STMICROELECTRONICS

DIP

LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32

unknown

EAR99

8542.32.00.61

STMicroelectronics

M27C1001-10L1LTR

STMicroelectronics

Check for Price

Obsolete

1.0486 Mbit

128KX8

5 V

100 ns

UVPROM

COMMON

128000

131.072 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

CMOS

COMMERCIAL

R-XQCC-N32

Not Qualified

70 °C

CERAMIC

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

STMICROELECTRONICS

not_compliant

EAR99

8542.32.00.61

MBM27C1001-25Z

FUJITSU Semiconductor Limited

Check for Price

Obsolete

1.0486 Mbit

128KX8

5 V

250 ns

UVPROM

128000

131.072 k

ASYNCHRONOUS

PARALLEL

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-GDIP-T32

Not Qualified

70 °C

CERAMIC, GLASS-SEALED

WDIP

RECTANGULAR

IN-LINE, WINDOW

THROUGH-HOLE

2.54 mm

DUAL

5.84 mm

41.91 mm

15.24 mm

FUJITSU SEMICONDUCTOR AMERICA INC

WDIP,

unknown

EAR99

8542.32.00.61

M27C1001-20XL1X

STMicroelectronics

Check for Price

Yes

Obsolete

1.0486 Mbit

128KX8

5 V

120 ns

UVPROM

COMMON

128000

131.072 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-CQCC-N32

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER, WINDOW

YES

GOLD

NO LEAD

1.27 mm

QUAD

2.28 mm

13.97 mm

11.43 mm

STMICROELECTRONICS

QFJ

CERAMIC, LCC-32

compliant

EAR99

8542.32.00.61

M27C1001-80XL1LTR

STMicroelectronics

Check for Price

Obsolete

1.0486 Mbit

128KX8

5 V

80 ns

UVPROM

COMMON

128000

131.072 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

CMOS

COMMERCIAL

R-XQCC-N32

Not Qualified

70 °C

CERAMIC

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

STMICROELECTRONICS

not_compliant

EAR99

8542.32.00.61

27C1001MEQ20

Thales Group

Check for Price

Transferred

1.0486 Mbit

128KX8

5 V

200 ns

UVPROM

128000

131.072 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-CQCC-N32

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

RECTANGULAR

CHIP CARRIER

YES

NO LEAD

QUAD

THOMSON-CSF SEMICONDUCTORS

QFJ

unknown

3A001.A.2.C

8542.32.00.61

27C1001MEQ20

Thomson-CSF Compsants Specific

Check for Price

Obsolete

THOMSON-CSF COMPSANTS SPECIFIC

unknown

EAR99

8542.32.00.71

M27C1001-90XL1XTR

STMicroelectronics

Check for Price

Obsolete

1.0486 Mbit

128KX8

5 V

90 ns

UVPROM

COMMON

128000

131.072 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

CMOS

COMMERCIAL

R-XQCC-N32

70 °C

CERAMIC

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

STMICROELECTRONICS

not_compliant

EAR99

8542.32.00.61

M27C1001-45XF3

STMicroelectronics

Check for Price

Yes

Obsolete

1.0486 Mbit

128KX8

5 V

45 ns

UVPROM

COMMON

128000

131.072 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

5.25 V

4.75 V

CMOS

AUTOMOTIVE

R-CDIP-T32

Not Qualified

125 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

WDIP

DIP32,.6

RECTANGULAR

IN-LINE, WINDOW

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

5.72 mm

41.885 mm

15.24 mm

STMICROELECTRONICS

DIP

LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32

compliant

EAR99

8542.32.00.61

AM27C100-125DC

AMD

Check for Price

Obsolete

1.0486 Mbit

128KX8

5 V

120 ns

UVPROM

COMMON

128000

131.072 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-GDIP-T32

Not Qualified

70 °C

CERAMIC, GLASS-SEALED

WDIP

DIP32,.6

RECTANGULAR

IN-LINE, WINDOW

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.588 mm

42.1005 mm

15.24 mm

ADVANCED MICRO DEVICES INC

DIP

WDIP, DIP32,.6

unknown

EAR99

8542.32.00.61

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