Findchips: Parametric Search Results for 27c512-90

Parametric results for: 27c512-90 under OTP ROMs

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		IS27C512-90W Integrated Silicon Solution Inc
		CY27C512-90PI Cypress Semiconductor
		27C512-90/L Microchip Technology Inc
		M27C512-90XC1TR STMicroelectronics
		M27C512-90N1X STMicroelectronics
		M27C512-90XC6 STMicroelectronics
		M27C512-90B1 STMicroelectronics
		M27C512-90XC1E STMicroelectronics
		M27C512-90XC3E STMicroelectronics
		27C512-90E/TS Microchip Technology Inc

				Most Relevant					Technical															Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Programming Voltage	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

90 ns

OTP ROM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

5 V

50 µA

15 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDIP-T28

Not Qualified

70 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

4.699 mm

36.576 mm

15.24 mm

INTEGRATED SILICON SOLUTION INC

DIP

0.600 INCH, PLASTIC, DIP-28

compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

90 ns

OTP ROM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

15 mA

40 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

R-PDIP-T28

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

THROUGH-HOLE

2.54 mm

DUAL

CYPRESS SEMICONDUCTOR CORP

DIP

0.600 INCH, PLASTIC, DIP-28

not_compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

90 ns

OTP ROM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

55 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PQCC-J32

Not Qualified

70 °C

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

YES

TIN LEAD

J BEND

1.27 mm

QUAD

MICROCHIP TECHNOLOGY INC

QFJ

QCCJ, LDCC32,.5X.6

unknown

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

524.288 kbit

64KX8

5 V

90 ns

OTP ROM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

5.5 V

4.75 V

CMOS

COMMERCIAL

R-PQCC-J32

Not Qualified

70 °C

NOT SPECIFIED

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

YES

J BEND

1.27 mm

QUAD

3.56 mm

13.97 mm

11.43 mm

STMICROELECTRONICS

QFJ

PLASTIC, LCC-32

unknown

EAR99

8542.32.00.71

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

90 ns

OTP ROM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDSO-G28

Not Qualified

70 °C

NOT SPECIFIED

PLASTIC/EPOXY

TSOP1

TSSOP28,.53,22

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

GULL WING

550 µm

DUAL

1.2 mm

11.8 mm

8 mm

STMICROELECTRONICS

TSOP

8 X 13.40 MM, PLASTIC, TSOP-28

unknown

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

524.288 kbit

64KX8

5 V

90 ns

OTP ROM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

5.5 V

4.75 V

CMOS

INDUSTRIAL

R-PQCC-J32

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

YES

J BEND

1.27 mm

QUAD

3.56 mm

13.97 mm

11.43 mm

STMICROELECTRONICS

QFJ

PLASTIC, LCC-32

unknown

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

524.288 kbit

64KX8

5 V

90 ns

OTP ROM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDIP-T28

Not Qualified

70 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

36.83 mm

15.24 mm

STMICROELECTRONICS

DIP

0.600 INCH, PLASTIC, DIP-28

unknown

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

524.288 kbit

64KX8

5 V

90 ns

OTP ROM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

5.5 V

4.75 V

CMOS

COMMERCIAL

R-PQCC-J32

Not Qualified

70 °C

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

YES

MATTE TIN

J BEND

1.27 mm

QUAD

3.56 mm

13.97 mm

11.43 mm

STMICROELECTRONICS

QFJ

ROHS COMPLIANT, PLASTIC, LCC-32

compliant

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

524.288 kbit

64KX8

5 V

90 ns

OTP ROM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

5.5 V

4.75 V

CMOS

AUTOMOTIVE

R-PQCC-J32

Not Qualified

125 °C

-40 °C

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

YES

MATTE TIN

J BEND

1.27 mm

QUAD

3.56 mm

13.97 mm

11.43 mm

STMICROELECTRONICS

QFJ

ROHS COMPLIANT, PLASTIC, LCC-32

compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

90 ns

OTP ROM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

65 µA

5.5 V

4.5 V

CMOS

AUTOMOTIVE

R-PDSO-G28

Not Qualified

125 °C

-40 °C

PLASTIC/EPOXY

SOP

TSSOP28/32,.8,20

RECTANGULAR

SMALL OUTLINE

YES

TIN LEAD

GULL WING

500 µm

DUAL

MICROCHIP TECHNOLOGY INC

TSOP

SOP, TSSOP28/32,.8,20

unknown

EAR99

8542.32.00.71

1 2 3 4 5 Next

Compare

IS27C512-90W

Integrated Silicon Solution Inc

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

90 ns

OTP ROM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

5 V

50 µA

15 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDIP-T28

Not Qualified

70 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

4.699 mm

36.576 mm

15.24 mm

INTEGRATED SILICON SOLUTION INC

DIP

0.600 INCH, PLASTIC, DIP-28

compliant

EAR99

8542.32.00.71

CY27C512-90PI

Cypress Semiconductor

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

90 ns

OTP ROM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

15 mA

40 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

R-PDIP-T28

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

THROUGH-HOLE

2.54 mm

DUAL

CYPRESS SEMICONDUCTOR CORP

DIP

0.600 INCH, PLASTIC, DIP-28

not_compliant

EAR99

8542.32.00.71

27C512-90/L

Microchip Technology Inc

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

90 ns

OTP ROM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

55 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PQCC-J32

Not Qualified

70 °C

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

YES

TIN LEAD

J BEND

1.27 mm

QUAD

MICROCHIP TECHNOLOGY INC

QFJ

QCCJ, LDCC32,.5X.6

unknown

EAR99

8542.32.00.71

M27C512-90XC1TR

STMicroelectronics

Check for Price

Yes

Obsolete

524.288 kbit

64KX8

5 V

90 ns

OTP ROM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

5.5 V

4.75 V

CMOS

COMMERCIAL

R-PQCC-J32

Not Qualified

70 °C

NOT SPECIFIED

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

YES

J BEND

1.27 mm

QUAD

3.56 mm

13.97 mm

11.43 mm

STMICROELECTRONICS

QFJ

PLASTIC, LCC-32

unknown

EAR99

8542.32.00.71

M27C512-90N1X

STMicroelectronics

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

90 ns

OTP ROM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDSO-G28

Not Qualified

70 °C

NOT SPECIFIED

PLASTIC/EPOXY

TSOP1

TSSOP28,.53,22

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

GULL WING

550 µm

DUAL

1.2 mm

11.8 mm

8 mm

STMICROELECTRONICS

TSOP

8 X 13.40 MM, PLASTIC, TSOP-28

unknown

EAR99

8542.32.00.71

M27C512-90XC6

STMicroelectronics

Check for Price

Yes

Obsolete

524.288 kbit

64KX8

5 V

90 ns

OTP ROM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

5.5 V

4.75 V

CMOS

INDUSTRIAL

R-PQCC-J32

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

YES

J BEND

1.27 mm

QUAD

3.56 mm

13.97 mm

11.43 mm

STMICROELECTRONICS

QFJ

PLASTIC, LCC-32

unknown

EAR99

8542.32.00.71

M27C512-90B1

STMicroelectronics

Check for Price

Yes

Obsolete

524.288 kbit

64KX8

5 V

90 ns

OTP ROM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDIP-T28

Not Qualified

70 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

36.83 mm

15.24 mm

STMICROELECTRONICS

DIP

0.600 INCH, PLASTIC, DIP-28

unknown

EAR99

8542.32.00.71

M27C512-90XC1E

STMicroelectronics

Check for Price

Yes

Obsolete

524.288 kbit

64KX8

5 V

90 ns

OTP ROM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

5.5 V

4.75 V

CMOS

COMMERCIAL

R-PQCC-J32

Not Qualified

70 °C

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

YES

MATTE TIN

J BEND

1.27 mm

QUAD

3.56 mm

13.97 mm

11.43 mm

STMICROELECTRONICS

QFJ

ROHS COMPLIANT, PLASTIC, LCC-32

compliant

EAR99

8542.32.00.71

M27C512-90XC3E

STMicroelectronics

Check for Price

Yes

Obsolete

524.288 kbit

64KX8

5 V

90 ns

OTP ROM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

30 µA

5.5 V

4.75 V

CMOS

AUTOMOTIVE

R-PQCC-J32

Not Qualified

125 °C

-40 °C

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

YES

MATTE TIN

J BEND

1.27 mm

QUAD

3.56 mm

13.97 mm

11.43 mm

STMICROELECTRONICS

QFJ

ROHS COMPLIANT, PLASTIC, LCC-32

compliant

EAR99

8542.32.00.71

27C512-90E/TS

Microchip Technology Inc

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

90 ns

OTP ROM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

65 µA

5.5 V

4.5 V

CMOS

AUTOMOTIVE

R-PDSO-G28

Not Qualified

125 °C

-40 °C

PLASTIC/EPOXY

SOP

TSSOP28/32,.8,20

RECTANGULAR

SMALL OUTLINE

YES

TIN LEAD

GULL WING

500 µm

DUAL

MICROCHIP TECHNOLOGY INC

TSOP

SOP, TSSOP28/32,.8,20

unknown

EAR99

8542.32.00.71

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