Findchips: Parametric Search Results for 27c64-2

Parametric results for: 27c64-2 under EPROMs

Select parts from the table below to compare.

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Select Parts		Part Number

		AM27C64-250LEB AMD
		AM27C64-255LC AMD
		TMS27C64-25JL Texas Instruments
		AM27C64-255DEB AMD
		27C64-25B/UX Microchip Technology Inc
		MD27C64-20/B Intel Corporation
		LD27C64-20 Rochester Electronics LLC
		AM27C64-200LI AMD
		27C64-20/J Microchip Technology Inc
		27C64-25B/UB Microchip Technology Inc

				Most Relevant					Technical															Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Programming Voltage	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

250 ns

UVPROM

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

30 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CQCC-N32

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

RECTANGULAR

CHIP CARRIER, WINDOW

YES

NO LEAD

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QFJ

WQCCN,

unknown

3A001.A.2.C

8542.32.00.61

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Obsolete

65.536 kbit

8KX8

5 V

250 ns

UVPROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

100 µA

30 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-CQCC-N32

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER, WINDOW

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QFJ

WQCCN, LCC32,.45X.55

unknown

EAR99

8542.32.00.61

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

250 ns

UVPROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

250 µA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-CDIP-T28

Not Qualified

70 °C

NOT SPECIFIED

CERAMIC, METAL-SEALED COFIRED

WDIP

DIP28,.6

RECTANGULAR

IN-LINE, WINDOW

THROUGH-HOLE

2.54 mm

DUAL

4.907 mm

36.83 mm

15.24 mm

TEXAS INSTRUMENTS INC

DIP

WDIP, DIP28,.6

not_compliant

EAR99

8542.32.00.61

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

250 ns

UVPROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

120 µA

30 µA

5.25 V

4.75 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

CERAMIC, GLASS-SEALED

WDIP

DIP28,.6

RECTANGULAR

IN-LINE, WINDOW

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.588 mm

37.1475 mm

15.24 mm

ADVANCED MICRO DEVICES INC

DIP

WDIP, DIP28,.6

unknown

3A001.A.2.C

8542.32.00.61

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

250 ns

EPROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 nA

CMOS

MILITARY

R-XQCC-N32

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

MICROCHIP TECHNOLOGY INC

unknown

3A001.A.2.C

8542.32.00.61

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

200 ns

UVPROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

140 µA

30 µA

5.5 V

4.5 V

CMOS

R-CDIP-T28

125 °C

-55 °C

UNSPECIFIED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

36.83 mm

15.24 mm

INTEL CORP

DIP-28

unknown

3A001.A.2.C

8542.32.00.61

Check for Price

Active

65.536 kbit

8KX8

5 V

200 ns

UVPROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

100 µA

30 µA

5.5 V

4.5 V

CMOS

R-GDIP-T28

85 °C

-40 °C

NOT SPECIFIED

CERAMIC, GLASS-SEALED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.15 mm

15.24 mm

ROCHESTER ELECTRONICS LLC

DIP-28

unknown

EAR99

8542.32.00.61

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

200 ns

UVPROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

100 µA

30 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

R-CQCC-N32

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER, WINDOW

YES

TIN LEAD

NO LEAD

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QFJ

WQCCN, LCC32,.45X.55

unknown

EAR99

8542.32.00.61

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

200 ns

EPROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

13 V

100 µA

20 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-GDIP-T28

Not Qualified

70 °C

CERAMIC, GLASS-SEALED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.461 mm

36.83 mm

15.24 mm

MICROCHIP TECHNOLOGY INC

DIP

0.600 INCH, CERDIP-28

unknown

EAR99

8542.32.00.61

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

250 ns

EPROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

65 mA

65 µA

CMOS

MILITARY

R-XQCC-N32

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

MICROCHIP TECHNOLOGY INC

unknown

3A001.A.2.C

8542.32.00.61

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Compare

AM27C64-250LEB

AMD

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

250 ns

UVPROM

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

30 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CQCC-N32

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

RECTANGULAR

CHIP CARRIER, WINDOW

YES

NO LEAD

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QFJ

WQCCN,

unknown

3A001.A.2.C

8542.32.00.61

AM27C64-255LC

AMD

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

250 ns

UVPROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

100 µA

30 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-CQCC-N32

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER, WINDOW

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QFJ

WQCCN, LCC32,.45X.55

unknown

EAR99

8542.32.00.61

TMS27C64-25JL

Texas Instruments

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

250 ns

UVPROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

250 µA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-CDIP-T28

Not Qualified

70 °C

NOT SPECIFIED

CERAMIC, METAL-SEALED COFIRED

WDIP

DIP28,.6

RECTANGULAR

IN-LINE, WINDOW

THROUGH-HOLE

2.54 mm

DUAL

4.907 mm

36.83 mm

15.24 mm

TEXAS INSTRUMENTS INC

DIP

WDIP, DIP28,.6

not_compliant

EAR99

8542.32.00.61

AM27C64-255DEB

AMD

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

250 ns

UVPROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

120 µA

30 µA

5.25 V

4.75 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

CERAMIC, GLASS-SEALED

WDIP

DIP28,.6

RECTANGULAR

IN-LINE, WINDOW

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.588 mm

37.1475 mm

15.24 mm

ADVANCED MICRO DEVICES INC

DIP

WDIP, DIP28,.6

unknown

3A001.A.2.C

8542.32.00.61

27C64-25B/UX

Microchip Technology Inc

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

250 ns

EPROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 nA

CMOS

MILITARY

R-XQCC-N32

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

MICROCHIP TECHNOLOGY INC

unknown

3A001.A.2.C

8542.32.00.61

MD27C64-20/B

Intel Corporation

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

200 ns

UVPROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

140 µA

30 µA

5.5 V

4.5 V

CMOS

R-CDIP-T28

125 °C

-55 °C

UNSPECIFIED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

36.83 mm

15.24 mm

INTEL CORP

DIP-28

unknown

3A001.A.2.C

8542.32.00.61

LD27C64-20

Rochester Electronics LLC

Check for Price

Active

65.536 kbit

8KX8

5 V

200 ns

UVPROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

100 µA

30 µA

5.5 V

4.5 V

CMOS

R-GDIP-T28

85 °C

-40 °C

NOT SPECIFIED

CERAMIC, GLASS-SEALED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.15 mm

15.24 mm

ROCHESTER ELECTRONICS LLC

DIP-28

unknown

EAR99

8542.32.00.61

AM27C64-200LI

AMD

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

200 ns

UVPROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

100 µA

30 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

R-CQCC-N32

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER, WINDOW

YES

TIN LEAD

NO LEAD

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QFJ

WQCCN, LCC32,.45X.55

unknown

EAR99

8542.32.00.61

27C64-20/J

Microchip Technology Inc

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

200 ns

EPROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

13 V

100 µA

20 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-GDIP-T28

Not Qualified

70 °C

CERAMIC, GLASS-SEALED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.461 mm

36.83 mm

15.24 mm

MICROCHIP TECHNOLOGY INC

DIP

0.600 INCH, CERDIP-28

unknown

EAR99

8542.32.00.61

27C64-25B/UB

Microchip Technology Inc

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

250 ns

EPROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

65 mA

65 µA

CMOS

MILITARY

R-XQCC-N32

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

MICROCHIP TECHNOLOGY INC

unknown

3A001.A.2.C

8542.32.00.61

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