Parametric results for: 27s25 under OTP ROMs

All Filters Access Time-Max JESD-30 Code JESD-609 Code Length Manufacturer Memory Density Memory IC Type Memory Width Moisture Sensitivity Level Number of Functions Number of Terminals Number of Words Number of Words Code Operating Mode Operating Temperature-Max Operating Temperature-Min Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style Supply Voltage-Nom (Vsup) Access Time-Max (18)

12 ns 2 15 ns 2 20 ns 1 25 ns 2 27 ns 1 35 ns 2 45 ns 3 50 ns 4 55 ns 4 70 ns 2 80 ns 2 90 ns 5 100 ns 2 120 ns 5 150 ns 6 170 ns 5 200 ns 7 250 ns 2

Min (ns) - Max (ns)

95 hits Apply

R-CQCC-N32 16 R-GDFP-F24 5 R-GDIP-T24 15 R-PDIP-T24 13 R-XDFP-F24 4 R-XDIP-T24 8 R-XQCC-N32 2 S-CQCC-N28 18 S-PQCC-J28 7

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e0 61

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11.43 mm 18 11.5062 mm 7 13.97 mm 16 15.367 mm 5 31.242 mm 9 31.9405 mm 15

Min (mm) - Max (mm)

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Manufacturer (3)

AMD 66 Cypress Semiconductor 1 Rochester Electronics LLC 28

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Memory Density (9)

4.096 kbit 31 8.192 kbit 7 16.384 kbit 6 65.536 kbit 5 131.072 kbit 8 262.144 kbit 9 524.288 kbit 13 1.0486 Mbit 3 4.1943 Mbit 6

Min (bit) - Max (bit)

95 hits Apply

OTP ROM 95

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Memory Width (4)

1 1 4 1 8 80 16 6

Min - Max

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NOT SPECIFIED 1

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1.0 88

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24 45 28 25 32 18

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512 words 88

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512.0 31 1000.0 6 2000.0 7 8000.0 4 16000.0 8 32000.0 9 64000.0 14 128000.0 3 256000.0 6

Min - Max

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ASYNCHRONOUS 50 SYNCHRONOUS 38

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70.0 °C 8 75.0 °C 37 125.0 °C 43

Min (°C) - Max (°C)

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-55.0 °C 43 0.0 °C 45

Min (°C) - Max (°C)

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Organization (11)

128KX8 3 16KX8 8 1KX8 6 256KX16 6 2KX4 1 2KX8 6 32KX8 9 512X8 31 64KX1 1 64KX8 13 8KX8 4

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3-STATE 48

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CERAMIC 14 CERAMIC, GLASS-SEALED 20 CERAMIC, METAL-SEALED COFIRED 34 PLASTIC/EPOXY 20

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DFP 9 DIP 36 QCCJ 7 QCCN 36

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DIP24,.3 27 FL24,.4 7 LCC28,.45SQ 12 LCC32,.45X.55 11 LDCC28,.5SQ 3

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RECTANGULAR 63 SQUARE 25

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CHIP CARRIER 43 FLATPACK 9 IN-LINE 36

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Supply Voltage-Nom (Vsup) (1)

5 V 88

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