Findchips: Parametric Search Results for 28F320C3BA100

Parametric results for: 28F320C3BA100 under Flash Memories

Select parts from the table below to compare.

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Select Parts		Part Number

		TE28F320C3BA100 Numonyx Memory Solutions
		RC28F320C3BA100 Intel Corporation
		GT28F320C3BA100 Numonyx Memory Solutions
		TE28F320C3BA100 Micron Technology Inc
		RC28F320C3BA100 Numonyx Memory Solutions
		GT28F320C3BA100 Intel Corporation
		RC28F320C3BA100 Rochester Electronics LLC
		TE28F320C3BA100 Intel Corporation
		GT28F320C3BA100 Micron Technology Inc
		RC28F320C3BA100 Micron Technology Inc

				Most Relevant						Technical																					Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

33.5544 Mbit

4K,32K

2MX16

3 V

100 ns

FLASH

USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

25 µA

18 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TSSOP

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

NUMONYX

TSOP

TSSOP, TSSOP48,.8,20

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

4K,32K

2MX16

3 V

100 ns

FLASH

USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

5 µA

55 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.2 mm

13 mm

10 mm

INTEL CORP

BGA

TBGA, BGA64,8X8,40

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

4K,32K

2MX16

3 V

100 ns

FLASH

USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

5 µA

55 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

BGA47,6X8,30

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

750 µm

BOTTOM

1 mm

7.286 mm

6.964 mm

NUMONYX

BGA

LEAD FREE, MICRO, BGA-48

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

4K,32K

2MX16

3 V

100 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

PARALLEL

3 V

25 µA

18 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

MICRON TECHNOLOGY INC

TSSOP, TSSOP48,.8,20

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

4K,32K

2MX16

3 V

100 ns

FLASH

USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK

BOTTOM

YES

8,31

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

25 µA

18 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

BALL

1 mm

BOTTOM

1.2 mm

13 mm

10 mm

NUMONYX

BGA

TBGA, BGA64,8X8,40

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

4K,32K

2MX16

3 V

100 ns

FLASH

USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

5 µA

55 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B47

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

BGA47,6X8,30

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

750 µm

BOTTOM

1 mm

10.85 mm

7.286 mm

INTEL CORP

BGA

MICRO, BGA-47

unknown

EAR99

8542.32.00.51

Check for Price

Active

33.5544 Mbit

2MX16

3 V

100 ns

FLASH

USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

3.3 V

2.7 V

INDUSTRIAL

R-PBGA-B64

COMMERCIAL

85 °C

-40 °C

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

BALL

1 mm

BOTTOM

1.2 mm

13 mm

10 mm

ROCHESTER ELECTRONICS LLC

BGA

TBGA,

unknown

Check for Price

Transferred

33.5544 Mbit

4K,32K

2MX16

3 V

100 ns

FLASH

USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

5 µA

55 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

INTEL CORP

TSOP

TSOP1, TSSOP48,.8,20

compliant

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

4K,32K

2MX16

3 V

100 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

PARALLEL

3 V

5 µA

55 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B47

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA47,6X8,30

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

750 µm

BOTTOM

1 mm

7.286 mm

6.964 mm

MICRON TECHNOLOGY INC

FBGA, BGA47,6X8,30

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

4K,32K

2MX16

3 V

100 ns

FLASH

USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK

BOTTOM

YES

8,31

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

25 µA

18 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

S-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.2 mm

13 mm

10 mm

MICRON TECHNOLOGY INC

BGA, BGA64,8X8,40

unknown

EAR99

8542.32.00.51

Compare

TE28F320C3BA100

Numonyx Memory Solutions

Check for Price

Obsolete

33.5544 Mbit

4K,32K

2MX16

3 V

100 ns

FLASH

USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

25 µA

18 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TSSOP

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

NUMONYX

TSOP

TSSOP, TSSOP48,.8,20

unknown

EAR99

8542.32.00.51

RC28F320C3BA100

Intel Corporation

Check for Price

Transferred

33.5544 Mbit

4K,32K

2MX16

3 V

100 ns

FLASH

USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

5 µA

55 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.2 mm

13 mm

10 mm

INTEL CORP

BGA

TBGA, BGA64,8X8,40

unknown

EAR99

8542.32.00.51

GT28F320C3BA100

Numonyx Memory Solutions

Check for Price

Obsolete

33.5544 Mbit

4K,32K

2MX16

3 V

100 ns

FLASH

USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

5 µA

55 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

BGA47,6X8,30

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

750 µm

BOTTOM

1 mm

7.286 mm

6.964 mm

NUMONYX

BGA

LEAD FREE, MICRO, BGA-48

unknown

EAR99

8542.32.00.51

TE28F320C3BA100

Micron Technology Inc

Check for Price

Obsolete

33.5544 Mbit

4K,32K

2MX16

3 V

100 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

PARALLEL

3 V

25 µA

18 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

MICRON TECHNOLOGY INC

TSSOP, TSSOP48,.8,20

unknown

EAR99

8542.32.00.51

RC28F320C3BA100

Numonyx Memory Solutions

Check for Price

Obsolete

33.5544 Mbit

4K,32K

2MX16

3 V

100 ns

FLASH

USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK

BOTTOM

YES

8,31

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

25 µA

18 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

BALL

1 mm

BOTTOM

1.2 mm

13 mm

10 mm

NUMONYX

BGA

TBGA, BGA64,8X8,40

unknown

EAR99

8542.32.00.51

GT28F320C3BA100

Intel Corporation

Check for Price

Transferred

33.5544 Mbit

4K,32K

2MX16

3 V

100 ns

FLASH

USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

5 µA

55 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B47

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

BGA47,6X8,30

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

750 µm

BOTTOM

1 mm

10.85 mm

7.286 mm

INTEL CORP

BGA

MICRO, BGA-47

unknown

EAR99

8542.32.00.51

RC28F320C3BA100

Rochester Electronics LLC

Check for Price

Active

33.5544 Mbit

2MX16

3 V

100 ns

FLASH

USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

3.3 V

2.7 V

INDUSTRIAL

R-PBGA-B64

COMMERCIAL

85 °C

-40 °C

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

BALL

1 mm

BOTTOM

1.2 mm

13 mm

10 mm

ROCHESTER ELECTRONICS LLC

BGA

TBGA,

unknown

TE28F320C3BA100

Intel Corporation

Check for Price

Transferred

33.5544 Mbit

4K,32K

2MX16

3 V

100 ns

FLASH

USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

5 µA

55 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

INTEL CORP

TSOP

TSOP1, TSSOP48,.8,20

compliant

EAR99

8542.32.00.51

GT28F320C3BA100

Micron Technology Inc

Check for Price

Obsolete

33.5544 Mbit

4K,32K

2MX16

3 V

100 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

PARALLEL

3 V

5 µA

55 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B47

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA47,6X8,30

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

750 µm

BOTTOM

1 mm

7.286 mm

6.964 mm

MICRON TECHNOLOGY INC

FBGA, BGA47,6X8,30

unknown

EAR99

8542.32.00.51

RC28F320C3BA100

Micron Technology Inc

Check for Price

Obsolete

33.5544 Mbit

4K,32K

2MX16

3 V

100 ns

FLASH

USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK

BOTTOM

YES

8,31

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

25 µA

18 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

S-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.2 mm

13 mm

10 mm

MICRON TECHNOLOGY INC

BGA, BGA64,8X8,40

unknown

EAR99

8542.32.00.51