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AT28LV010-20TU
Atmel Corporation
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$24.7833 | Yes | Yes | Transferred | 1.0486 Mbit | 8 | 128KX8 | 3.3 V | 200 ns | EEPROM | NO | YES | 100000 Write/Erase Cycles | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 128 words | PARALLEL | 3 V | 50 µA | 15 µA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | YES | 10 ms | R-PDSO-G32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 32 | PLASTIC/EPOXY | TSSOP | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 8 mm | ATMEL CORP | TSOP1 | 8 X 20 MM, GREEN, PLASTIC, MO-142BD, TSOP1-32 | 32 | unknown | EAR99 | 8542.32.00.51 | Microchip | |||||||
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AT28LV010-20JU
Atmel Corporation
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$24.7919 | Yes | Yes | Transferred | 1.0486 Mbit | 8 | 128KX8 | 3.3 V | 200 ns | EEPROM | NO | YES | 100000 Write/Erase Cycles | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 128 words | PARALLEL | 3 V | 50 µA | 15 µA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | YES | 10 ms | R-PQCC-J32 | Not Qualified | e3 | 2 | 85 °C | -40 °C | 245 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | ATMEL CORP | QFJ | GREEN, PLASTIC, MS-016AE, LCC-32 | 32 | unknown | EAR99 | 8542.32.00.51 | Microchip | |||||||
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AT28LV010-20JU-T
Microchip Technology Inc
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$26.5492 | Yes | Active | 1.0486 Mbit | 8 | 128KX8 | 3.3 V | 200 ns | EEPROM | NO | YES | 10 | 100000 Write/Erase Cycles | 1 | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 128 words | PARALLEL | 3.3 V | 50 µA | 15 mA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | YES | 10 ms | R-PQCC-J32 | e3 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | QCCJ | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | MICROCHIP TECHNOLOGY INC | QCCJ, | compliant | EAR99 | 8542.32.00.51 | Microchip | |||||||||||
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AT28LV010-20TU-T
Microchip Technology Inc
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$28.5581 | Yes | Active | 1.0486 Mbit | 8 | 128KX8 | 3.3 V | 200 ns | EEPROM | NO | YES | 10 | 100000 Write/Erase Cycles | 1 | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 128 words | PARALLEL | 3.3 V | 50 µA | 15 mA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | YES | 10 ms | R-PDSO-G32 | e3 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | TSOP1 | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 8 mm | MICROCHIP TECHNOLOGY INC | TSOP1, | compliant | 3A991.A.2 | 8542.31.00.01 | Microchip | |||||||||||
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AT28LV010-20JU-051
Microchip Technology Inc
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$30.2100 | Yes | Yes | Active | 1.0486 Mbit | 8 | 128KX8 | 3.3 V | 200 ns | EEPROM | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 3 V | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | 10 ms | R-PQCC-J32 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 32 | PLASTIC/EPOXY | QCCJ | RECTANGULAR | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | MICROCHIP TECHNOLOGY INC | LCC-32 | compliant | EAR99 | 8542.32.00.51 | Microchip | ||||||||||||||||||||
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AT28LV010-20TU-630
Microchip Technology Inc
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$31.1075 | Yes | Active | 1.0486 Mbit | 8 | 128KX8 | 3.3 V | 200 ns | EEPROM | 10 | 100000 Write/Erase Cycles | 1 | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 3 V | 50 µA | 15 µA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | 10 ms | HARDWARE/SOFTWARE | R-PDSO-G32 | e3 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | TSOP1 | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 8 mm | MICROCHIP TECHNOLOGY INC | TSOP1-32 | compliant | EAR99 | 8542.32.00.51 | Microchip | ||||||||||||||
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AT28LV010-20JU-235
Microchip Technology Inc
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$31.2592 | Yes | Active | 1.0486 Mbit | 8 | 128KX8 | 3.3 V | 200 ns | EEPROM | 10 | 100000 Write/Erase Cycles | 1 | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 3 V | 50 µA | 15 µA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | 10 ms | HARDWARE/SOFTWARE | R-PQCC-J32 | e3 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | QCCJ | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | MICROCHIP TECHNOLOGY INC | LCC-32 | compliant | EAR99 | 8542.32.00.51 | Microchip | ||||||||||||||
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AT28LV010-20TU-235
Microchip Technology Inc
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$31.4052 | Yes | Active | 1.0486 Mbit | 8 | 128KX8 | 3.3 V | 200 ns | EEPROM | 10 | 100000 Write/Erase Cycles | 1 | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 3 V | 50 µA | 15 µA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | 10 ms | HARDWARE/SOFTWARE | R-PDSO-G32 | e3 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | TSOP1 | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 8 mm | MICROCHIP TECHNOLOGY INC | TSOP1-32 | compliant | EAR99 | 8542.32.00.51 | Microchip | ||||||||||||||
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AT28LV010-20TU
Microchip Technology Inc
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$32.5461 | Yes | Yes | Active | 1.0486 Mbit | 8 | 128KX8 | 3.3 V | 200 ns | EEPROM | NO | YES | 10 | 100000 Write/Erase Cycles | 1 | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | 128 words | PARALLEL | 3.3 V | 50 µA | 15 µA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | YES | 10 ms | R-PDSO-G32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | TSSOP | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 8 mm | MICROCHIP TECHNOLOGY INC | TSSOP, TSSOP32,.8,20 | compliant | Microchip | |||||||||
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AT28LV010-20JU-630
Microchip Technology Inc
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$37.7265 | Yes | Active | 1.0486 Mbit | 8 | 128KX8 | 3.3 V | 200 ns | EEPROM | 10 | 100000 Write/Erase Cycles | 1 | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 3 V | 50 µA | 15 µA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | 10 ms | HARDWARE/SOFTWARE | R-PQCC-J32 | e3 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | QCCJ | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | MICROCHIP TECHNOLOGY INC | LCC-32 | compliant | EAR99 | 8542.32.00.51 | Microchip |