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AT24C128C-SSHM-B
Atmel Corporation
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$0.2530 | Yes | Yes | Transferred | 131.072 kbit | 8 | 16KX8 | 2.5 V | 1 MHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 16000 | 16.384 k | SYNCHRONOUS | SERIAL | I2C | 1 µA | 3 µA | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE/SOFTWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.925 mm | 3.9 mm | ATMEL CORP | SOIC | SOP, SOP8,.25 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | |||||||||||||
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AT24C128C-XHM-B
Atmel Corporation
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$0.3280 | Yes | Yes | Transferred | 131.072 kbit | 8 | 16KX8 | 2.5 V | 1 MHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 16000 | 16.384 k | SYNCHRONOUS | SERIAL | I2C | 1 µA | 3 µA | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE/SOFTWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | ATMEL CORP | TSSOP | TSSOP, TSSOP8,.25 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | |||||||||||||
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28C0236-0DW-10
LAIRD PLC
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$0.3966 | Yes | Yes | Active | 1 | e3 | 2 | Tin (Sn) | LAIRD TECHNOLOGIES INC | ROHS COMPLIANT PACKAGE-2 | unknown | EAR99 | 8504.50.80.00 | Laird Technologies | 10 mΩ | 6 mm | FERRITE BEAD | 10 mm | THROUGH HOLE MOUNT | 460 OHM Ω | 5 A | |||||||||||||||||||||||||||||||||||||||||||||||||
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28C0236-0EW-10
LAIRD PLC
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$0.4012 | Yes | Yes | Active | 1 | e3 | 2 | Tin (Sn) | LAIRD TECHNOLOGIES INC | ROHS COMPLIANT PACKAGE-2 | compliant | EAR99 | 8504.50.80.00 | Laird Technologies | 10 mΩ | 6 mm | FERRITE BEAD | 10 mm | THROUGH HOLE MOUNT | 998 OHM Ω | 5 A | |||||||||||||||||||||||||||||||||||||||||||||||||
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28C0236-0BS-10
LAIRD PLC
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$0.4102 | Yes | Yes | Active | 1 | e3 | 2 | Matte Tin (Sn) - with Nickel (Ni) barrier | LAIRD TECHNOLOGIES INC | ROHS COMPLIANT PACKAGE-2 | unknown | EAR99 | 8504.50.80.00 | Laird Technologies | 10 mΩ | 6 mm | FERRITE BEAD | 10 mm | THROUGH HOLE MOUNT | 835 OHM Ω | 5 A | |||||||||||||||||||||||||||||||||||||||||||||||||
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RM25C128C-LSNI-T
Adesto Technologies Corporation
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$0.4379 | Yes | Yes | Transferred | 131.072 kbit | 1 | 128KX1 | 3.3 V | 10 MHz | EEPROM | 10 | 10000 Write/Erase Cycles | 1 | 1 | 128000 | 131.072 k | SYNCHRONOUS | SERIAL | 3.3 V | SPI | 119 µA | 3 µA | 3.6 V | 1.65 V | CMOS | INDUSTRIAL | 5 ms | R-PDSO-G8 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.925 mm | 3.9 mm | ADESTO TECHNOLOGIES CORP | SOIC-8 | compliant | EAR99 | 8542.32.00.51 | Adesto Technologies | |||||||||||||||||||||
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AT24C128C-MAHM-T
Microchip Technology Inc
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$0.4473 | Yes | Yes | Active | 131.072 kbit | 8 | 16KX8 | 3 V | 1 MHz | EEPROM | 1.7V TO 5.5V @ 0.4MHz | 100 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 16000 | 16.384 k | SYNCHRONOUS | SERIAL | 3 V | I2C | 6 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-N8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.12,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 600 µm | 3 mm | 2 mm | MICROCHIP TECHNOLOGY INC | HVSON, SOLCC8,.11,20 | compliant | Microchip | ||||||||||||||
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RM24C128C-LSNI-T
Adesto Technologies Corporation
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$0.4586 | Yes | Transferred | 131.072 kbit | 1 | 128KX1 | 3.3 V | 1 MHz | EEPROM | 1 | 128000 | 131.072 k | SYNCHRONOUS | SERIAL | I2C | 3.6 V | 1.65 V | CMOS | INDUSTRIAL | R-PDSO-G8 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.925 mm | 3.9 mm | ADESTO TECHNOLOGIES CORP | SOIC-8 | compliant | EAR99 | 8542.32.00.51 | Adesto Technologies | ||||||||||||||||||||||||||||||
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AT24C128C-SSHM-B
Microchip Technology Inc
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$0.4625 | Yes | Yes | Active | 131.072 kbit | 8 | 16KX8 | 3 V | 1 MHz | EEPROM | 1.7V TO 5.5V @ 0.4MHz | 100 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 16000 | 16.384 k | SYNCHRONOUS | SERIAL | 3 V | I2C | 6 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.925 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOP, SOP8,.25 | compliant | Microchip | ||||||||||||||
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28C0236-0BW-10
LAIRD PLC
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$0.4669 | Yes | Yes | Active | 1 | e3 | Matte Tin (Sn) - with Nickel (Ni) barrier | LAIRD TECHNOLOGIES INC | compliant | Laird Technologies | 10 mΩ | 6 mm | FERRITE BEAD | 10 mm | THROUGH HOLE MOUNT | 835 OHM Ω | 5 A | D6.0XH10.0 (mm)/D0.236XH0.394 (inch) |