Parametric results for: 3235e under Other Circular Connectors

All Filters Additional Feature Body Breadth Body Depth Body Length Contact Configuration Contact Finish Mating Contact Finish Termination Contact Material Contact Style Current Rating Device Socket Type Device Type Used On Dielectric Withstanding Voltage Housing Material Insulation Resistance JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts Operating Temperature-Max Operating Temperature-Min PCB Contact Pattern PCB Contact Row Spacing Part Life Cycle Code Pbfree Code Rohs Code Terminal Pitch Termination Type

1.0 OZ. AVG. INSERTION FORCE 12 2.5 OZ. AVG. INSERTION FORCE 12 LOW PROFILE; UL 94V-0 8 PGA SOCKET 4 STANDARD: UL 94V-0 67 UL 94V-0 6

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0.4 inch 10 0.9 inch 28 1.4 inch 72 1.9 inch 21 2.1 inch 73

Min (inch) - Max (inch)

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0.031 inch 2 0.13 inch 48 0.155 inch 7 0.165 inch 106 0.166 inch 1 0.209 inch 222 0.47 inch 4

Min (inch) - Max (inch)

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0.9 inch 24 1.4 inch 72 1.6 inch 4 1.9 inch 21 2.1 inch 73 2.19 inch 4 3.2 inch 6

Min (inch) - Max (inch)

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14X14 72 19X19 21 21X21 73 9X9 24 RECTANGLE 16

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AU 49 AU ON NI 12 GOLD (10) OVER NICKEL 1 GOLD (10) OVER NICKEL (50) 16 GOLD (30) OVER NICKEL 2 GOLD (30) OVER NICKEL (50) 4 GOLD OVER NICKEL 71 MATTE TIN (200) OVER NICKEL 1 MATTE TIN (200) OVER NICKEL (50) 9 NICKEL BORON (50) 20 NOT APPLICABLE 10 NOT SPECIFIED 13 SN-PB 48 SN-PB ON NI 7 TIN LEAD (200) OVER NICKEL 7 TIN LEAD (200) OVER NICKEL (50) 3 TIN LEAD OVER NICKEL 35

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GOLD 2 GOLD (10) OVER NICKEL 1 Gold (Au) - with Nickel (Ni) barrier 93 GOLD OVER NICKEL 109 Matte Tin (Sn) - with Nickel (Ni) barrier 34 MATTE TIN OVER NICKEL 2 Nickel/Boron (Ni/B) 20 TIN 1 Tin (Sn) - with Nickel (Ni) barrier 3 TIN LEAD 1 TIN LEAD OVER NICKEL 89 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier 115 TIN/LEAD OVER NICKEL 2

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Contact Material (10)

BE-CU 117 BE-NI 3 BERYLLIUM COPPER 71 BERYLLIUM COPPER ALLOY 59 BERYLLIUM NICKEL 3 BERYLLIUM NICKEL ALLOY 7 BRASS 10 NOT APPLICABLE 10 NOT SPECIFIED 13 SPINODAL ALLOY 6

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RND PIN-SKT 396 SQ PIN-SKT 4

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Current Rating (2)

1 A 4 3 A 11

Min (A) - Max (A)

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IC SOCKET 490

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DIP32 93 PGA132 72 PGA243 21 PGA293 21 PGA313 21 PGA32 24 PGA323 76 PGA373 21 PGA383 4 PGA403 21 PGA423 16 PGA463 16 PGA503 47 PGA613 21

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1000VAC V 5

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GLASS FILLED EPOXY 39 GLASS FILLED POLYAMIDE 4 GLASS FILLED POLYAMIDE46 8 GLASS FILLED THERMOPLASTIC 72 LIQUID CRYSTAL POLYMER 162 NYLON 6 NYLON46 9 POLYAMIDE 13 POLYETHERETHERKETONE 10 POLYIMIDE 99 POLYPHENYLENE SULFIDE 40 THERMOPLASTIC 2 THERMOPLASTIC POLYESTER 10

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1 GΩ 4 5 GΩ 1

Min (Ω) - Max (Ω)

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e0 204 e3 39 e4 203

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Manufacturer (6)

Advanced Interconnections Corp 397 Aries Electronics Inc 81 Mill-Max Mfg Corp 10 TE Connectivity 1 Thomas & Betts 2 Woodhead Molex 18

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0.1 inch 384

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STRAIGHT 400

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Number of Contacts (12)

32 117 132 72 243 21 293 21 313 21 323 80 373 21 403 21 423 16 463 16 503 47 613 21

Min - Max

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105.0 °C 5 125.0 °C 7 140.0 °C 47 150.0 °C 2 200.0 °C 1 250.0 °C 4 260.0 °C 38 400.0 °C 12

Min (°C) - Max (°C)

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-269.0 °C 12 -65.0 °C 1 -60.0 °C 80 -55.0 °C 5 -20.0 °C 1

Min (°C) - Max (°C)

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RECTANGULAR 400

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100 µm 358 300 µm 26 400 µm 4 600 µm 4 900 µm 4

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Active 209 Obsolete 300

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No 17 Yes 87

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No 180 Yes 112

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Terminal Pitch (2)

2.54 mm 384 7.62 mm 16

Min (mm) - Max (mm)

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SOLDER 399 WIRE WRAP 1

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