Findchips: Parametric Search Results for 5962-8852511XX


Select Parts		Part Number

		5962-8852511XX e2v technologies
		5962-8852511XX LSI Corporation
		5962-8852511XX Microchip Technology Inc
		5962-8852511XX Xicor Inc
		5962-8852511XX Atmel Corporation

				Most Relevant					Technical													Compliance			Operating Conditions			Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Write Cycle Time-Max (tWC)	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Screening Level	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Obsolete

262.144 kbit

32KX8

5 V

250 ns

EEPROM

AUTOMATIC WRITE

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.72 mm

37.215 mm

15.24 mm

TELEDYNE E2V (UK) LTD

DIP

DIP,

unknown

3A001.A.2.C

8542.32.00.51

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

250 ns

EEPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

THROUGH-HOLE

DUAL

SEEQ TECHNOLOGY INC

DIP

DIP,

unknown

3A001.A.2.C

8542.32.00.51

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

250 ns

EEPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

THROUGH-HOLE

2.54 mm

DUAL

5.72 mm

37.215 mm

15.24 mm

MICROCHIP TECHNOLOGY INC

DIP-28

compliant

3A001.A.2.C

8542.32.00.51

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

250 ns

EEPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

THROUGH-HOLE

DUAL

XICOR INC

DIP,

unknown

Check for Price

Transferred

262.144 kbit

32KX8

5 V

250 ns

EEPROM

AUTOMATIC WRITE

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.72 mm

37.215 mm

15.24 mm

ATMEL CORP

DIP

DIP,

compliant

3A001.A.2.C

8542.32.00.51

Compare

5962-8852511XX

e2v technologies

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

250 ns

EEPROM

AUTOMATIC WRITE

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.72 mm

37.215 mm

15.24 mm

TELEDYNE E2V (UK) LTD

DIP

DIP,

unknown

3A001.A.2.C

8542.32.00.51

5962-8852511XX

LSI Corporation

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

250 ns

EEPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

THROUGH-HOLE

DUAL

SEEQ TECHNOLOGY INC

DIP

DIP,

unknown

3A001.A.2.C

8542.32.00.51

5962-8852511XX

Microchip Technology Inc

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

250 ns

EEPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

THROUGH-HOLE

2.54 mm

DUAL

5.72 mm

37.215 mm

15.24 mm

MICROCHIP TECHNOLOGY INC

DIP-28

compliant

3A001.A.2.C

8542.32.00.51

5962-8852511XX

Xicor Inc

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

250 ns

EEPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

THROUGH-HOLE

DUAL

XICOR INC

DIP,

unknown

5962-8852511XX

Atmel Corporation

Check for Price

Transferred

262.144 kbit

32KX8

5 V

250 ns

EEPROM

AUTOMATIC WRITE

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.72 mm

37.215 mm

15.24 mm

ATMEL CORP

DIP

DIP,

compliant

3A001.A.2.C

8542.32.00.51

Parametric results for: 5962-8852511XX under EEPROMs