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5962-8852514XX
LSI Corporation
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Check for Price | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 150 ns | EEPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5 V | 5.5 V | 4.5 V | CMOS | MILITARY | 10 ms | R-GDIP-T28 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 Class B | 28 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | SEEQ TECHNOLOGY INC | DIP | DIP, | 28 | unknown | 3A001.A.2.C | 8542.32.00.51 | |||||||||||||||||||||
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5962-8852514XX
Atmel Corporation
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Check for Price | No | No | Transferred | 262.144 kbit | 8 | 32KX8 | 5 V | 150 ns | EEPROM | AUTOMATIC WRITE | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5 V | 5.5 V | 4.5 V | CMOS | MILITARY | 10 ms | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 Class B | 28 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.72 mm | 37.215 mm | 15.24 mm | ATMEL CORP | DIP | DIP, | 28 | compliant | 3A001.A.2.C | 8542.32.00.51 | ||||||||||||
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5962-8852514XX
Xicor Inc
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Check for Price | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 150 ns | EEPROM | NO | YES | 10 | 10000 Write/Erase Cycles | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 64 words | PARALLEL | 5 V | 350 µA | 80 µA | 5.5 V | 4.5 V | CMOS | MILITARY | NO | 10 ms | SOFTWARE | R-GDIP-T28 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 Class B | 28 | CERAMIC, GLASS-SEALED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | XICOR INC | CERAMIC, DIP-28 | unknown | ||||||||||||||
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5962-8852514XX
Microchip Technology Inc
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 150 ns | EEPROM | AUTOMATIC WRITE | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5 V | 5.5 V | 4.5 V | CMOS | MILITARY | 10 ms | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 Class B | 28 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.72 mm | 37.215 mm | 15.24 mm | MICROCHIP TECHNOLOGY INC | 0.600 INCH, CERAMIC, DIP-28 | compliant | 3A001.A.2.C | 8542.32.00.51 | |||||||||||||||
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5962-8852514XX
e2v technologies
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 150 ns | EEPROM | AUTOMATIC WRITE | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5 V | 5.5 V | 4.5 V | CMOS | MILITARY | 10 ms | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 Class B | 28 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.72 mm | 37.215 mm | 15.24 mm | TELEDYNE E2V (UK) LTD | DIP | DIP, | 28 | unknown | 3A001.A.2.C | 8542.32.00.51 |