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5962-8961406MYC
QP Semiconductor
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Check for Price | Transferred | 1.0486 Mbit | 8 | 128KX8 | 5 V | 120 ns | UVPROM | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | e4 | 125 °C | -55 °C | MIL-STD-883 | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | RECTANGULAR | CHIP CARRIER | YES | GOLD | NO LEAD | QUAD | QP SEMICONDUCTOR INC | QFJ | QCCN, | 32 | unknown | 3A001.A.2.C | 8542.32.00.61 | |||||||||||
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5962-8961406MYC
Waferscale Integration Inc
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Check for Price | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 120 ns | UVPROM | COMMON | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 60 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 | 32 | CERAMIC, METAL-SEALED COFIRED | WQCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER, WINDOW | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | WAFERSCALE INTEGRATION INC | WINDOWED, CERAMIC, LCC-32 | unknown | 3A001.A.2.C | 8542.32.00.61 | ||||
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5962-8961406MYC
Teledyne e2v
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Check for Price | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 120 ns | UVPROM | COMMON | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 60 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | e4 | 125 °C | -55 °C | MIL-STD-883 | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | GOLD | NO LEAD | 1.27 mm | QUAD | E2V TECHNOLOGIES PLC | QFJ | QCCN, LCC32,.45X.55 | 32 | compliant | 3A001.A.2.C | 8542.32.00.61 |