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69F192G24RTFH
Data Device Corporation
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Check for Price | Transferred | 201.3266 Mbit | 24 | 8MX24 | 3.3 V | FLASH | 1 | 8000000 | 8.3886 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | MILITARY | SLC NAND TYPE | R-PDFP-F70 | 125 °C | -55 °C | 70 | PLASTIC/EPOXY | DFP | RECTANGULAR | FLATPACK | YES | FLAT | 635 µm | DUAL | 7.0866 mm | 25.4 mm | 20.828 mm | DATA DEVICE CORP | FLATPACK-70 | compliant | 3A001.A.2.C | 8542.32.00.51 | |||
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69F192G24RTFK
Data Device Corporation
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Check for Price | Transferred | 201.3266 Mbit | 24 | 8MX24 | 3.3 V | FLASH | 1 | 8000000 | 8.3886 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | MILITARY | SLC NAND TYPE | R-PDFP-F70 | 125 °C | -55 °C | 70 | PLASTIC/EPOXY | DFP | RECTANGULAR | FLATPACK | YES | FLAT | 635 µm | DUAL | 7.0866 mm | 25.4 mm | 20.828 mm | DATA DEVICE CORP | FLATPACK-70 | compliant | 3A001.A.2.C | 8542.32.00.51 | |||
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69F128G16RPFI
Data Device Corporation
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Check for Price | No | Transferred | 137.439 Gbit | 16 | 8GX16 | 3.3 V | FLASH | 1 | 8000000000 | 8.5899 G | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | MILITARY | SLC NAND TYPE | R-CDFP-F68 | 125 °C | -55 °C | 68 | CERAMIC, METAL-SEALED COFIRED | DFP | RECTANGULAR | FLATPACK | YES | FLAT | 635 µm | DUAL | 7.0866 mm | 25.4 mm | 20.828 mm | DATA DEVICE CORP | FP-68 | compliant | 3A001.A.2.C | 8542.32.00.51 | ||
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69F128G16RPFK
Maxwell Technologies
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Check for Price | Transferred | 137.439 Gbit | 16 | 8GX16 | 3.3 V | FLASH | 1 | 8000000000 | 8.5899 G | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | MILITARY | SLC NAND TYPE | R-CDFP-F68 | 125 °C | -55 °C | 68 | CERAMIC, METAL-SEALED COFIRED | DFP | RECTANGULAR | FLATPACK | YES | FLAT | 635 µm | DUAL | 7.0866 mm | 25.4 mm | 20.828 mm | MAXWELL TECHNOLOGIES INC | DFP, | unknown | 3A001.A.2.C | 8542.32.00.51 | |||
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69F192G24RTFI
Maxwell Technologies
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Check for Price | Transferred | 201.3266 Mbit | 24 | 8MX24 | 3.3 V | FLASH | 1 | 8000000 | 8.3886 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | MILITARY | SLC NAND TYPE | R-PDFP-F70 | 125 °C | -55 °C | 70 | PLASTIC/EPOXY | DFP | RECTANGULAR | FLATPACK | YES | FLAT | 635 µm | DUAL | 7.0866 mm | 25.4 mm | 20.828 mm | MAXWELL TECHNOLOGIES INC | FLATPACK-70 | unknown | 3A001.A.2.C | 8542.32.00.51 | |||
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69F24G24RPFK
Data Device Corporation
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Check for Price | Transferred | 25.1658 Mbit | 24 | 1MX24 | 3.3 V | FLASH | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | MILITARY | SLC NAND TYPE | R-PDFP-F70 | 125 °C | -55 °C | 70 | PLASTIC/EPOXY | DFP | RECTANGULAR | FLATPACK | YES | FLAT | 635 µm | DUAL | 7.0866 mm | 25.4 mm | 20.828 mm | DATA DEVICE CORP | FLATPACK-70 | compliant | 3A001.A.2.C | 8542.32.00.51 | |||
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69F24G24RPFI
Data Device Corporation
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Check for Price | Transferred | 25.1658 Mbit | 24 | 1MX24 | 3.3 V | FLASH | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | MILITARY | SLC NAND TYPE | R-PDFP-F70 | 125 °C | -55 °C | 70 | PLASTIC/EPOXY | DFP | RECTANGULAR | FLATPACK | YES | FLAT | 635 µm | DUAL | 7.0866 mm | 25.4 mm | 20.828 mm | DATA DEVICE CORP | DFP, | compliant | 3A001.A.2.C | 8542.32.00.51 | |||
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69F96G24RTFK
Maxwell Technologies
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Check for Price | Transferred | 100.6633 Mbit | 24 | 4MX24 | 3.3 V | FLASH | 1 | 4000000 | 4.1943 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | MILITARY | SLC NAND TYPE | R-PDFP-F70 | 125 °C | -55 °C | 70 | PLASTIC/EPOXY | DFP | RECTANGULAR | FLATPACK | YES | FLAT | 635 µm | DUAL | 7.0866 mm | 25.4 mm | 20.828 mm | MAXWELL TECHNOLOGIES INC | FLATPACK-70 | unknown | 3A001.A.2.C | 8542.32.00.51 | |||
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69F24G24RPFH
Maxwell Technologies
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Check for Price | Transferred | 25.1658 Mbit | 24 | 1MX24 | 3.3 V | FLASH | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | MILITARY | SLC NAND TYPE | R-PDFP-F70 | 125 °C | -55 °C | 70 | PLASTIC/EPOXY | DFP | RECTANGULAR | FLATPACK | YES | FLAT | 635 µm | DUAL | 7.0866 mm | 25.4 mm | 20.828 mm | MAXWELL TECHNOLOGIES INC | DFP, | unknown | 3A001.A.2.C | 8542.32.00.51 | |||
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69F256G16RPFH
Maxwell Technologies
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Check for Price | Transferred | 274.8779 Gbit | 16 | 16GX16 | 3.3 V | FLASH | 1 | 16000000000 | 17.1799 G | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | MILITARY | SLC NAND TYPE | R-CDFP-F68 | 125 °C | -55 °C | 68 | CERAMIC, METAL-SEALED COFIRED | DFP | RECTANGULAR | FLATPACK | YES | FLAT | 635 µm | DUAL | 7.0866 mm | 25.4 mm | 20.828 mm | MAXWELL TECHNOLOGIES INC | FP-68 | unknown | 3A001.A.2.C | 8542.32.00.51 |