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IDT70T3339S133BFG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 9.4372 Mbit | 18 | 512KX18 | 2.5 V | 15 ns | 133 MHz | MULTI-PORT SRAM | FLOW-THROUGH OR PIPELINED ARCHITECTURE | COMMON | 1 | 2 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 2.4 V | 370 µA | 2.6 V | 2.4 V | CMOS | COMMERCIAL | S-PBGA-B208 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 208 | PLASTIC/EPOXY | TFBGA | BGA208,17X17,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 15 mm | 15 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | TFBGA, BGA208,17X17,32 | 208 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||
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70T3339S133BFG8
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 9.4372 Mbit | 18 | 512KX18 | 2.5 V | 15 ns | 133 MHz | MULTI-PORT SRAM | FLOW-THROUGH OR PIPELINED ARCHITECTURE | COMMON | 1 | 2 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 2.4 V | 370 µA | 2.6 V | 2.4 V | CMOS | COMMERCIAL | S-PBGA-B208 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 208 | PLASTIC/EPOXY | TFBGA | BGA208,17X17,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 15 mm | 15 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | TFBGA, BGA208,17X17,32 | 208 | compliant | 3A991.B.2.A | 8542.32.00.41 |