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Manufacturer Part Number: 70t3519
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70T3519S166BC
 Integrated Device Technology Inc 		$114.7819 No No Transferred 9.4372 Mbit 36 256KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 3 70 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 256 BC256 not_compliant 3A991.B.2.A 8542.32.00.41
70T3519S133BFI
 Integrated Device Technology Inc 		$137.0586 No No Transferred 9.4372 Mbit 36 256KX36 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 208 BF208 not_compliant 3A991.B.2.A 8542.32.00.41
70T3519S166BC
 Renesas Electronics Corporation 		$323.3257 No No Obsolete 9.4372 Mbit 36 256KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 3 70 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm RENESAS ELECTRONICS CORP CABGA 256 BC256 not_compliant NLR 8542320041 Renesas Electronics
70T3519S133BF
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 36 256KX36 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 370 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 208 BF208 not_compliant 3A991.B.2.A 8542.32.00.41
70T3519S200BC
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 36 256KX36 2.5 V 10 ns 200 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 525 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 3 70 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 256 BC256 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70T3519S200BC8
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 36 256KX36 2.5 V 10 ns 200 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 525 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 3 70 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn63Pb37) BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 not_compliant 3A991.B.2.A 8542.32.00.41
70T3519S166DRI
 Integrated Device Technology Inc 		Check for Price No No Obsolete 9.4372 Mbit 36 256KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 510 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PQFP-G208 Not Qualified e0 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 208 PLASTIC/EPOXY FQFP QFP208,1.2SQ,20 SQUARE FLATPACK, FINE PITCH YES Tin/Lead (Sn/Pb) GULL WING 500 µm QUAD 4.1 mm 28 mm 28 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 28 X 28 MM, 3.50 MM HEIGHT, PLASTIC, QFP-208 208 compliant 3A991.B.2.A 8542.32.00.41
IDT70T3519S166BFGI8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 36 256KX36 12 ns 166 MHz MULTI-PORT SRAM COMMON 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 510 µA CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e1 3 85 °C -40 °C 260 30 208 PLASTIC/EPOXY FBGA BGA208,17X17,32 SQUARE GRID ARRAY, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC FBGA, BGA208,17X17,32 compliant 3A991.B.2.A 8542.32.00.41
70T3519S166BCI
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 36 256KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 510 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 256 BC256 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70T3519S166BCGI8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 36 256KX36 12 ns 166 MHz MULTI-PORT SRAM COMMON 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 510 µA CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e1 3 85 °C -40 °C 260 30 256 PLASTIC/EPOXY BGA BGA256,16X16,40 SQUARE GRID ARRAY YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC BGA, BGA256,16X16,40 compliant 3A991.B.2.A 8542.32.00.41
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