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Manufacturer Part Number: 70t3519s166bci
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70T3519S166BCI8
 Integrated Device Technology Inc 		$145.4418 No No Transferred 9.4372 Mbit 36 256KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 510 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 256 BC256 not_compliant 3A991.B.2.A 8542.32.00.41
70T3519S166BCI
 Integrated Device Technology Inc 		$176.1058 No No Transferred 9.4372 Mbit 36 256KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 510 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 256 BC256 not_compliant 3A991.B.2.A 8542.32.00.41
70T3519S166BCI
 Renesas Electronics Corporation 		Check for Price No No Active 9.4372 Mbit 36 256KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 510 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm RENESAS ELECTRONICS CORP CABGA 256 BC256 not_compliant NLR 8542320041 Renesas Electronics
IDT70T3519S166BCI8
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 36 256KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 510 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn63Pb37) BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 not_compliant 3A991.B.2.A 8542.32.00.41
70T3519S166BCI8
 Renesas Electronics Corporation 		Check for Price No No End Of Life 9.4372 Mbit 36 256KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 510 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm RENESAS ELECTRONICS CORP CABGA 256 BC256 not_compliant NLR 8542320041 Renesas Electronics
IDT70T3519S166BCI
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 36 256KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 510 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn63Pb37) BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 not_compliant 3A991.B.2.A 8542.32.00.41