Parametric results for: 70T633S12BFGI8 under SRAMs

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Manufacturer Part Number: 70t633s12bfgi8
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70T633S12BFGI8
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 9.4372 Mbit 18 512KX18 2.5 V 12 ns MULTI-PORT SRAM COMMON 1 2 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 395 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e1 3 85 °C -40 °C 260 30 208 PLASTIC/EPOXY BGA BGA208,17X17,32 SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 800 µm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC CABGA FBGA-208 208 BFG208 compliant 3A991.B.2.A 8542.32.00.41
70T633S12BFGI8
Renesas Electronics Corporation
Check for Price Yes Yes Obsolete 9.4372 Mbit 18 512KX18 2.5 V 12 ns MULTI-PORT SRAM COMMON 1 2 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 395 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e1 3 85 °C -40 °C 260 30 208 PLASTIC/EPOXY BGA BGA208,17X17,32 SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 800 µm BOTTOM RENESAS ELECTRONICS CORP CABGA 208 BFG208 compliant NLR 8542320041 Renesas Electronics
IDT70T633S12BFGI8
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 9.4372 Mbit 18 512KX18 12 ns MULTI-PORT SRAM COMMON 2 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 395 µA CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e1 3 85 °C -40 °C 260 30 208 PLASTIC/EPOXY FBGA BGA208,17X17,32 SQUARE GRID ARRAY, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC FBGA, BGA208,17X17,32 compliant 3A991.B.2.A 8542.32.00.41